公开(公告)号：US20170322319A1

公开(公告)日：2017-11-09

申请号：US15144861

申请日：2016-05-03

申请人： REDLEN TECHNOLOGIES, INC.

发明人： Kris INIEWSKI ,  Glenn BINDLEY

IPC分类号： G01T1/17 ,  G01T1/24

CPC分类号： G01T1/24 ,  G01T1/171

摘要： Various embodiments described herein may include a detector array for a CT imaging system. The detector array includes a pixel array in which each pair of adjacent pixels in the pixel array may be separated by a collimator (e.g., located between each row and column of the pixel array) that absorbs photons and each pixel in the pixel array includes a sub-pixel array. The collimator absorbs photons that strike at a boundary between adjacent pixels. Each sub-pixel may have an anode that is connected to an ASIC channel When a sub-pixel in a pixel detects a photon, signals of a plurality of sub-pixels in the pixel are automatically summed, including the sub-pixel that detected the photon.

公开(公告)号：US20190339402A1

公开(公告)日：2019-11-07

申请号：US15972717

申请日：2018-05-07

申请人： REDLEN TECHNOLOGIES, INC.

发明人： Robert CRESTANI ,  Christopher READ ,  Michael AYUKAWA ,  Glenn BINDLEY ,  Kris INIEWSKI

IPC分类号： G01T1/24 ,  G01T1/20

摘要： A radiation detector unit includes an interposer, at least one radiation sensor bonded to a front side of an interposer, an application-specific integrated chip (ASIC) bonded to a backside of the interposer, a carrier board bonded to the backside of the interposer and located on a backside of the ASIC, and at least one flex cable assembly attached to a respective side of the carrier board.