公开(公告)号：US20240418877A1

公开(公告)日：2024-12-19

申请号：US18612350

申请日：2024-03-21

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Krzysztof INIEWSKI ,  Michael K. JACKSON ,  Yuxin SONG

IPC: G01T1/24 ,  G01N23/046 ,  G01N23/083

Abstract: Application specific integrated circuits (ASICs) for direct attach radiation detector structures include an array of unit cells including signal processing channel circuitry and data transmission through-substrate vias (TSVs) with reduced cross-talk between the signal processing channel circuitry and the data transmission TSVs.

公开(公告)号：US20230375729A1

公开(公告)日：2023-11-23

申请号：US18318987

申请日：2023-05-17

Applicant: REDLEN TECHNOLOGIES, INC.

Inventor： Yuxin SONG ,  Brad AITCHISON ,  Michael Kevin JACKSON

IPC: G01T1/24

CPC classification number: G01T1/241 ,  G01T1/244 ,  G01T1/247

Abstract: Radiation detectors include a radiation-sensitive semiconductor substrate and at least one asymmetric contact (i.e., a cathode electrode or anode electrode) that exhibits different blocking effect for charge carriers (i.e., holes and electrons) of opposite types. In one exemplary embodiment, a radiation detector includes a cathode electrode having a first metallic material having a work function that is ≥4.6 over a first surface of the radiation-sensitive semiconductor substrate, and at least one anode electrode including a second metallic material having a work function that is