公开(公告)号：US20190295930A1

公开(公告)日：2019-09-26

申请号：US16281619

申请日：2019-02-21

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Yoshinori DEGUCHI ,  Iwao NATORI ,  Seiya ISOZAKI

IPC: H01L23/495 ,  H01L23/532 ,  H01L23/00

Abstract: A pad is formed on an interlayer insulating film, art insulating film is formed on the interlayer insulating film to cover the pad, and an opening portion exposing a part of the pad is formed in the insulating film. A metal film electrically connected to the pad is formed on the pad exposed from the opening portion and on the insulating film. The metal film integrally includes a first portion on the pad exposed from the opening portion and a second portion on the insulating film. An upper surface of the metal film has a wire bonding region for bonding a wire to the metal film and a probe contact region for bringing the probe into contact with the metal film, the wire bonding region is located on the first portion of the metal film, and the probe contact region is located on the second portion of the metal film.