公开(公告)号：US20200168540A1

公开(公告)日：2020-05-28

申请号：US16653098

申请日：2019-10-15

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Yoshitaka OKAYASU ,  Shuuichi KARIYAZAKI

IPC: H01L23/498 ,  H01L23/00 ,  H01L25/16

Abstract: The lower surface of the wiring substrate includes a first region overlapping with the semiconductor chip mounted on the upper surface, and a second region surrounding the first region and not overlapping with the semiconductor chip. The first region includes a third region in which the plurality of external terminals is not arranged, and a fourth region surrounding the third region in which the plurality of external terminals is arranged. The plurality of external terminals includes a plurality of terminals arranged in the fourth region of the first region and a plurality of terminals arranged in the second region. The plurality of terminals includes a plurality of power supply terminals for supplying a power supply potential to the core circuit of the semiconductor chip, and a plurality of reference terminals for supplying a reference potential to the core circuit of the semiconductor chip.

公开(公告)号：US20190115295A1

公开(公告)日：2019-04-18

申请号：US16057724

申请日：2018-08-07

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Shuuichi KARIYAZAKI ,  Keita TSUCHIYA ,  Yoshitaka OKAYASU ,  Wataru SHIROI

IPC: H01L23/498 ,  H01L23/00

Abstract: A semiconductor device has a wiring substrate on which a semiconductor chip is mounted. A wiring layer of the wiring substrate has a wiring. This wiring has a main wiring unit extending in a direction “X” and a plurality of sub-wiring units extending in a direction “Y”, in a cross sectional view, and is supplied with a power source potential. The wiring layer has a wiring. This wiring has a main wiring unit extending in the direction “X” and a plurality of sub-wiring units extending in the direction “Y”, in a cross sectional view, and is supplied with a reference potential. The sub-wiring units and the sub-wiring units have end units and end units on a side opposed to the end units, and are alternately arranged along the direction “X” between the main wiring units. To the end units, via wirings are coupled.