公开(公告)号：US20250163267A1

公开(公告)日：2025-05-22

申请号：US18729013

申请日：2022-12-22

Applicant: RESONAC CORPORATION

Inventor： Masashi OJI ,  Yuichi SHIMAYAMA ,  Koji MORITA ,  Kosuke MURAI ,  Masaki YAMAGUCHI

IPC: C08L71/12 ,  C08J5/18 ,  C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C08K5/315 ,  C08K5/3445 ,  C08K5/521 ,  C08K7/18 ,  C09D155/00 ,  H01Q1/38 ,  H05K1/03

Abstract: To provide a thermosetting resin composition which is useful for an antenna module capable of coping with a signal in a high-frequency band and having excellent mesh passability. Specifically disclosed is a thermosetting resin composition containing (A) a thermosetting resin and (B) at least one inorganic filler selected from the group consisting of a titanium-based inorganic filler and a zircon-based inorganic filler, in which in the component (B), a content of particles having a particle diameter of 1.0 μm or less is 30% by volume or less based on the component (B). And to provide a prepreg, a resin film, a laminate, a printed wiring board, an antenna device, an antenna module, and a communication device obtained by using the thermosetting resin composition.