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公开(公告)号：US20210116178A1
公开(公告)日：2021-04-22
申请号：US17134492
申请日：2020-12-27
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain , James M. Shrake , Evan Zaldivar , Babu Gopala Krishna Santhosh Kadambari , Matt Earl Hay , Jim Eugene McMeel
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device.
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公开(公告)号：US10928135B2
公开(公告)日：2021-02-23
申请号：US16363742
申请日：2019-03-25
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain , James M. Shrake
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device.
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公开(公告)号：US11713924B2
公开(公告)日：2023-08-01
申请号：US17134492
申请日：2020-12-27
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain , James M. Shrake , Evan Zaldivar , Babu Gopala Krishna Santhosh Kadambari , Matt Earl Hay , Jim Eugene McMeel
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device.
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公开(公告)号：US10690413B2
公开(公告)日：2020-06-23
申请号：US16575306
申请日：2019-09-18
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain , James M. Shrake , Evan Zaldivar , Babu Gopala Krishna Santhosh Kadambari
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device.
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公开(公告)号：US09816757B1
公开(公告)日：2017-11-14
申请号：US15688551
申请日：2017-08-28
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain
CPC分类号： F26B25/22 , F26B3/02 , F26B5/04 , F26B9/06 , F26B2200/00
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.
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公开(公告)号：US20190219332A1
公开(公告)日：2019-07-18
申请号：US16363742
申请日：2019-03-25
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain , James M. Shrake
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device.
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公开(公告)号：US10240867B2
公开(公告)日：2019-03-26
申请号：US15979446
申请日：2018-05-14
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain , James M. Shrake
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device.
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公开(公告)号：US09970708B2
公开(公告)日：2018-05-15
申请号：US15811633
申请日：2017-11-13
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain , James M. Shrake
CPC分类号： F26B25/22 , F26B3/02 , F26B5/04 , F26B9/06 , F26B2200/00
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.
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公开(公告)号：US09746241B2
公开(公告)日：2017-08-29
申请号：US15478992
申请日：2017-04-04
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain
CPC分类号： F26B25/22 , F26B3/02 , F26B5/04 , F26B9/06 , F26B2200/00
摘要： Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.
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公开(公告)号：US20230375270A1
公开(公告)日：2023-11-23
申请号：US18228504
申请日：2023-07-31
发明人： Reuben Zielinski , Joel Trusty , David Douberteen , Mark Earle , Imran Arain , James M. Shrake , Evan Zaldivar , Babu Gopala Krishna Santhosh Kadambari , Matt Earl Hay , Jim Eugene McMeel
摘要： Methods and apparatuses for drying electronic devices are disclosed. An exemplary method comprises: placing a portable electronic device into a drying chamber; providing a first air channel, wherein the first air channel connects the drying chamber, a pressure-generating device, and a moisture-reducing device; generating a first air flow through the first air channel using the pressure-generating device; removing a first moisture from an interior of the portable electronic device to an exterior of the portable electronic device; detecting moisture removed from the portable electronic device; pausing the generating the first air flow through the first air channel based on the amount of moisture; providing a second air channel, wherein the second air channel connects the moisture-reducing device, the pressure-generating device, a valve, and an evacuation channel; generating a second air flow through the second air channel using the pressure-generating device; and removing a second moisture from the moisture-reducing device.
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