EFFICIENT HEAT PUMP EJECTOR VACUUM DRYER
    3.
    发明公开

    公开(公告)号:US20240093939A1

    公开(公告)日:2024-03-21

    申请号:US18467310

    申请日:2023-09-14

    IPC分类号: F26B23/00 F26B5/04

    摘要: An efficient heat pump ejector vacuum dryer system and associated method of use for drying items that includes a drying vessel having a condenser and having a first evaporator where the first evaporator has an input that is connected to an output of the first expansion valve, a first expansion valve connected in fluid communication between the condenser and the first evaporator, a second expansion valve connected between the condenser and the second evaporator, a compressor having an input connected to an output of the first evaporator, an ejector that receives a vapor stream from an output of the compressor and receives a vapor stream from the output of the second evaporator generates as an output a high-temperature vapor provided to a condenser of the drying vessel to dry the items and generate an output of moisture, and a water reservoir that accumulates water from the drying vessel.

    Methods and apparatuses for drying electronic devices

    公开(公告)号:US09970708B2

    公开(公告)日:2018-05-15

    申请号:US15811633

    申请日:2017-11-13

    摘要: Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.

    Methods and apparatuses for drying electronic devices

    公开(公告)号:US09746241B2

    公开(公告)日:2017-08-29

    申请号:US15478992

    申请日:2017-04-04

    摘要: Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device.

    PLASMA VACUUM SYSTEM HAVING A COMPLETELY ENCLOSED CHAMBER EXTRUDED PROFILE

    公开(公告)号:US20170122663A1

    公开(公告)日:2017-05-04

    申请号:US15405644

    申请日:2017-01-13

    IPC分类号: F26B5/04 B01J19/08 H01J37/32

    摘要: A vacuum system, such as the form of a plasma system, includes a vacuum chamber. The side walls of the vacuum chamber are configured in the form of a completely closed chamber extruded profile. A first end face of the chamber extruded profile is closed off with a plate. A second end face of the chamber extruded profile, which lies opposite the first end face, has a reversibly openable and closable door. The door is fastened by at least one hinge pivotably to the chamber extruded profile. The side walls, which are fully closed transversely to the longitudinal axis of the chamber extruded profile, enable a simple and cost-effective production of the vacuum chamber. The vacuum chamber may be accommodated at least partially in a housing, which may likewise be configured at least partially in the form of an extruded profile.