公开(公告)号：US20130234780A1

公开(公告)日：2013-09-12

申请号：US13867662

申请日：2013-04-22

Applicant: RICHTEK TECHNOLOGY CORP.

Inventor： Hung-Shou NIEN ,  Chung-Sheng CHENG

IPC: H03K3/011

CPC classification number: H03K3/011 ,  H02M3/1588 ,  H02M2001/0025 ,  Y02B70/1466

Abstract: For thermal compensation for an intrinsic element in a system, a circuit and method are proposed to predict the temperature variation caused by power loss of the intrinsic element, in addition to sense the external environment temperature variation of the intrinsic element, and thus sense the operational temperature of the intrinsic element more precisely.

Abstract translation: 对于系统中本征元件的热补偿，提出了一种电路和方法来预测由本征元件的功率损耗引起的温度变化，以及感测本征元件的外部环境温度变化，从而感知操作 内在元素的温度更精确。