公开(公告)号：US11955363B2

公开(公告)日：2024-04-09

申请号：US17742095

申请日：2022-05-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Moshe Amit ,  Chia-Te Chou ,  Arvind Jaikumar

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67092 ,  H01L21/6875 ,  H01L21/68757 ,  H01L21/68785

Abstract: A bonding fixture. In some embodiments, the fixture includes: a plate for supporting a central region of the wafer, the central region including 80% of the area of the wafer; and a frame for supporting: the edge of the wafer, and the edge of the plate, the frame having: a first vacuum passage, for pulling the wafer against an upper surface of the frame, and a second vacuum passage, for pulling the plate against the frame.