公开(公告)号：US11342270B2

公开(公告)日：2022-05-24

申请号：US16690054

申请日：2019-11-20

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Seungjae Lee ,  Brett Sawyer ,  Chia-Te Chou

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31

Abstract: A system integrating a fan-out package, including a first semiconductor die, with a second semiconductor die. In some embodiments the fan-out package includes the first semiconductor die, a mold compound, covering the first semiconductor die on at least two sides, and an electrical contact, on a lower surface of the first semiconductor die. The fan-out package may have a rabbet along a portion of a lower edge of the fan-out package.

公开(公告)号：US11262603B2

公开(公告)日：2022-03-01

申请号：US16900714

申请日：2020-06-12

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Yi Zhang ,  Chia-Te Chou ,  Sanna Leena Mäkelä

IPC: G02F1/01

Abstract: A silicon photonic integrated circuit with a heater. In some embodiments, the silicon photonic integrated circuit includes a first waveguide, on a top surface of the silicon integrated circuit, and a heater element, on the first waveguide. The heater element may include a first metal layer, on the first waveguide, and a second metal layer, on the first metal layer, the second metal layer having a different composition than the first metal layer, the second layer having a thickness of less than 300 nm.

公开(公告)号：US11955363B2

公开(公告)日：2024-04-09

申请号：US17742095

申请日：2022-05-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Moshe Amit ,  Chia-Te Chou ,  Arvind Jaikumar

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67092 ,  H01L21/6875 ,  H01L21/68757 ,  H01L21/68785

Abstract: A bonding fixture. In some embodiments, the fixture includes: a plate for supporting a central region of the wafer, the central region including 80% of the area of the wafer; and a frame for supporting: the edge of the wafer, and the edge of the plate, the frame having: a first vacuum passage, for pulling the wafer against an upper surface of the frame, and a second vacuum passage, for pulling the plate against the frame.

公开(公告)号：US20240077688A1

公开(公告)日：2024-03-07

申请号：US18271217

申请日：2022-01-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  William Vis ,  Alexander Gondarenko ,  Shuhe Li ,  David McCann ,  Haydn Frederick Jones ,  Alexander Fast

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/428

Abstract: An optical assembly (100) for use in a wearable device is provided, the assembly (100) comprising: a prism (104), a photonic integrated chip, PIC (108), a substrate layer (106), and a lid (102); wherein the PIC (108) is mounted onto the substrate layer (106); the prism (104) comprising: (i) a first input/output surface (112) optically coupled to the PIC (108), and (ii) a second input/output surface (114) optically coupled to the lid (102), the second input/output surface (114) orientated perpendicularly to the first input/output surface (112), and wherein the prism (104) provides an optical path and reflects a percentage of light from the first input/output surface (112) to the second input/output surface (114). Methods of manufacturing such an optical assembly are also provided.

公开(公告)号：US11520112B2

公开(公告)日：2022-12-06

申请号：US17092151

申请日：2020-11-06

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Yi Zhang ,  Chia-Te Chou ,  William Vis ,  Amit Singh Nagra ,  Hooman Abediasl

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/125 ,  G02B6/132 ,  G02B6/136

Abstract: An optoelectronic device. The device comprising: a silicon-on-insulator, SOI, wafer, the SOI wafer including a cavity and an input waveguide, the input waveguide being optically coupled into the cavity; and a mirror, located within the cavity and bonded to a bed thereof, the mirror including a reflector configured to reflect light received from the input waveguide in the SOI wafer.

公开(公告)号：US20200073050A1

公开(公告)日：2020-03-05

申请号：US16505674

申请日：2019-07-08

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  David Arlo Nelson ,  Javid Messian ,  Thomas Pierre Schrans ,  Chia-Te Chou ,  Karlheinz Muth

IPC: G02B6/122 ,  H01L31/024 ,  H01L31/02 ,  H01L33/62 ,  H01L33/64

Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

公开(公告)号：US11054597B2

公开(公告)日：2021-07-06

申请号：US16382076

申请日：2019-04-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K1/02 ,  H05K3/30

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US10921538B2

公开(公告)日：2021-02-16

申请号：US16382076

申请日：2019-04-11

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Vivek Raghunathan ,  Vivek Raghuraman ,  Karlheinz Muth ,  David Arlo Nelson ,  Chia-Te Chou ,  Brett Sawyer ,  SeungJae Lee

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42 ,  H01L25/16 ,  H05K1/02 ,  H05K3/30

Abstract: An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

公开(公告)号：US10761262B2

公开(公告)日：2020-09-01

申请号：US16051237

申请日：2018-07-31

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Gerald Cois Byrd ,  Chia-Te Chou ,  Karlheinz Muth

IPC: G02B6/12 ,  G02B6/42 ,  H01L25/16 ,  H04B10/25 ,  H04B10/40

Abstract: An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

公开(公告)号：US12119307B2

公开(公告)日：2024-10-15

申请号：US17504125

申请日：2021-10-18

Applicant: ROCKLEY PHOTONICS LIMITED

Inventor： Chia-Te Chou ,  Brett Sawyer ,  David McCann

IPC: H01L23/544 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2224/1301 ,  H01L2224/16167 ,  H01L2224/17517 ,  H01L2924/146 ,  H01L2924/15323

Abstract: An assembly. In some embodiments, the assembly includes a first semiconductor chip, a substrate, and a first alignment element. The alignment of the first semiconductor chip and the substrate may be determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip.