Semiconductor device
    1.
    发明授权

    公开(公告)号:US10090294B2

    公开(公告)日:2018-10-02

    申请号:US15449479

    申请日:2017-03-03

    Applicant: ROHM CO., LTD.

    Abstract: A semiconductor device, including a semiconductor layer of a first conductivity type, having a main surface with a diode trench formed therein, an inner wall insulating film, including a side wall insulating film, formed along side walls of the diode trench, and a bottom wall insulating film, formed along a bottom wall of the diode trench and having a thickness greater than a thickness of the side wall insulating film, and a bidirectional Zener diode, formed on the bottom wall insulating film inside the diode trench and having a pair of first conductivity type portions and at least one second conductivity type portion formed between the pair of first conductivity type portions.

    Semiconductor device
    7.
    发明授权

    公开(公告)号:US10566325B2

    公开(公告)日:2020-02-18

    申请号:US16105518

    申请日:2018-08-20

    Applicant: ROHM CO., LTD.

    Abstract: A semiconductor device, including a semiconductor layer of a first conductivity type, having a main surface with a diode trench formed therein, an inner wall insulating film, including a side wall insulating film, formed along side walls of the diode trench, and a bottom wall insulating film, formed along a bottom wall of the diode trench and having a thickness greater than a thickness of the side wall insulating film, and a bidirectional Zener diode, formed on the bottom wall insulating film inside the diode trench and having a pair of first conductivity type portions and at least one second conductivity type portion formed between the pair of first conductivity type portions.

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