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公开(公告)号:US10090294B2
公开(公告)日:2018-10-02
申请号:US15449479
申请日:2017-03-03
Applicant: ROHM CO., LTD.
Inventor: Kenji Nishida , Shinpei Ohnishi , Kentaro Nasu
IPC: H01L29/866 , H01L27/06 , H01L29/739 , H01L29/423 , H01L29/06
Abstract: A semiconductor device, including a semiconductor layer of a first conductivity type, having a main surface with a diode trench formed therein, an inner wall insulating film, including a side wall insulating film, formed along side walls of the diode trench, and a bottom wall insulating film, formed along a bottom wall of the diode trench and having a thickness greater than a thickness of the side wall insulating film, and a bidirectional Zener diode, formed on the bottom wall insulating film inside the diode trench and having a pair of first conductivity type portions and at least one second conductivity type portion formed between the pair of first conductivity type portions.
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公开(公告)号:USD822627S1
公开(公告)日:2018-07-10
申请号:US29598525
申请日:2017-03-27
Applicant: ROHM CO., LTD.
Designer: Kentaro Nasu , Kenji Nishida
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公开(公告)号:US12154900B2
公开(公告)日:2024-11-26
申请号:US18065997
申请日:2022-12-14
Applicant: ROHM CO., LTD.
Inventor: Kentaro Nasu , Kenji Nishida
IPC: H01L27/02 , H01L23/522 , H01L27/06 , H01L27/088 , H01L29/06 , H01L29/423 , H01L29/78 , H01L21/8234 , H01L23/495 , H01L29/08 , H01L29/417 , H01L29/49
Abstract: A semiconductor device includes an enhancement-mode first p-channel MISFET, an enhancement-mode second p-channel MISFET, a drain conductor electrically and commonly connected to the first p-channel MISFET and the second p-channel MISFET, a first source conductor electrically connected to a source of the first p-channel MISFET, a second source conductor electrically connected to a source of the second p-channel MISFET, and a gate conductor electrically and commonly connected to a gate of the first p-channel MISFET and a gate of the second p-channel MISFET.
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公开(公告)号:US10692863B2
公开(公告)日:2020-06-23
申请号:US15713015
申请日:2017-09-22
Applicant: ROHM CO., LTD.
Inventor: Kentaro Nasu , Kenji Nishida
IPC: H01L27/088 , H01L23/522 , H01L27/02 , H01L29/78 , H01L29/06 , H01L29/423 , H01L27/06 , H01L29/08 , H01L29/417 , H01L29/49 , H01L23/495 , H01L21/8234
Abstract: A semiconductor device includes an enhancement-mode first p-channel MISFET, an enhancement-mode second p-channel MISFET, a drain conductor electrically and commonly connected to the first p-channel MISFET and the second p-channel MISFET, a first source conductor electrically connected to a source of the first p-channel MISFET, a second source conductor electrically connected to a source of the second p-channel MISFET, and a gate conductor electrically and commonly connected to a gate of the first p-channel MISFET and a gate of the second p-channel MISFET.
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公开(公告)号:USD823270S1
公开(公告)日:2018-07-17
申请号:US29598520
申请日:2017-03-27
Applicant: ROHM CO., LTD.
Designer: Kentaro Nasu , Kenji Nishida
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公开(公告)号:US11557587B2
公开(公告)日:2023-01-17
申请号:US16874347
申请日:2020-05-14
Applicant: ROHM CO., LTD.
Inventor: Kentaro Nasu , Kenji Nishida
IPC: H01L27/08 , H01L27/088 , H01L23/522 , H01L27/02 , H01L29/78 , H01L29/06 , H01L29/423 , H01L27/06 , H01L29/08 , H01L29/417 , H01L29/49 , H01L23/495 , H01L21/8234
Abstract: A semiconductor device includes an enhancement-mode first p-channel MISFET, an enhancement-mode second p-channel MISFET, a drain conductor electrically and commonly connected to the first p-channel MISFET and the second p-channel MISFET, a first source conductor electrically connected to a source of the first p-channel MISFET, a second source conductor electrically connected to a source of the second p-channel MISFET, and a gate conductor electrically and commonly connected to a gate of the first p-channel MISFET and a gate of the second p-channel MISFET.
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公开(公告)号:US10566325B2
公开(公告)日:2020-02-18
申请号:US16105518
申请日:2018-08-20
Applicant: ROHM CO., LTD.
Inventor: Kenji Nishida , Shinpei Ohnishi , Kentaro Nasu
IPC: H01L27/06 , H01L29/866 , H01L29/739 , H01L29/423 , H01L29/06 , H01L29/66 , H01L29/78 , H01L29/40 , H01L29/16 , H01L29/20
Abstract: A semiconductor device, including a semiconductor layer of a first conductivity type, having a main surface with a diode trench formed therein, an inner wall insulating film, including a side wall insulating film, formed along side walls of the diode trench, and a bottom wall insulating film, formed along a bottom wall of the diode trench and having a thickness greater than a thickness of the side wall insulating film, and a bidirectional Zener diode, formed on the bottom wall insulating film inside the diode trench and having a pair of first conductivity type portions and at least one second conductivity type portion formed between the pair of first conductivity type portions.
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公开(公告)号:USD822628S1
公开(公告)日:2018-07-10
申请号:US29598531
申请日:2017-03-27
Applicant: ROHM CO., LTD.
Designer: Kentaro Nasu , Kenji Nishida
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