-
公开(公告)号：US20250014787A1
公开(公告)日：2025-01-09
申请号：US18896065
申请日：2024-09-25
Applicant: ROHM CO., LTD.
Inventor： Kentaro NAKA
IPC: H01C1/148 , H01C7/13 , H01C17/245
Abstract: A shunt resistor includes: a resistive element; and a first terminal portion and a second terminal portion. The resistive element has a first end and a second end in a second direction orthogonal to a first direction that is a thickness direction of the resistive element, the second end being an end opposite to the first end, and the resistive element has a third end and a fourth end in a third direction orthogonal to the first direction and the second direction, the fourth end being an end opposite to the third end. The first terminal portion and the second terminal portion are joined to the first end and the second end, respectively.
-
公开(公告)号：US20160343480A1
公开(公告)日：2016-11-24
申请号：US15161744
申请日：2016-05-23
Applicant: ROHM CO., LTD.
Inventor： Kentaro NAKA , Masaki YONEDA
CPC classification number: H01C1/148 , H01C17/006 , H01C17/281
Abstract: There is provided a chip resistor suitable for power detection. The chip resistor includes a resistor having a resistor lower surface and a resistor upper surface which face mutually opposite sides in a thickness direction, a pair of resistor first side surfaces spaced apart from each other in a first direction perpendicular to the thickness direction, and a pair of resistor second side surfaces spaced apart from each other in a second direction perpendicular to both the thickness direction and the first direction, a first electrode formed along one resistor first side surface, and a second electrode formed along the other resistor first side surface, and spaced apart from the first electrode.
Abstract translation: 提供了适用于功率检测的片式电阻器。 芯片电阻器包括具有电阻器下表面的电阻器和在厚度方向上彼此相对的侧面的电阻器上表面，一对电阻器第一侧表面在垂直于厚度方向的第一方向上彼此间隔开，以及 一对电阻器第二侧表面在垂直于厚度方向和第一方向的第二方向彼此间隔开，沿着一个电阻器第一侧表面形成的第一电极和沿另一个电阻器第一侧表面形成的第二电极， 并与第一电极间隔开。
-
3.发明申请CHIP RESISTOR, METHOD OF PRODUCING CHIP RESISITOR AND CHIP RESISTOR PACKAGING STRUCTURE 审中-公开芯片电阻器，生产芯片电阻器和芯片电阻器封装结构的方法公开(公告)号：US20170013719A1
公开(公告)日：2017-01-12
申请号：US15276490
申请日：2016-09-26
Applicant: ROHM CO., LTD.
Inventor： Kentaro NAKA
CPC classification number: H05K1/181 , H01C1/01 , H01C1/14 , H01C17/006 , H01C17/28 , H01C17/281 , H05K2201/10022 , Y10T29/49082
Abstract: [Object] A method for efficiently manufacturing chip resistors is provided.[Means] The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.
Abstract translation: 该方法包括以下步骤：制备由导电材料制成的至少三个导电细长板711和由电阻材料制成的电阻构件702，将至少三个导电细长板711沿着宽度 在至少三个导电细长板711中的一个被拉长的纵向上的方向交叉，通过将电阻构件702结合到至少三个导电细长板711而形成电阻体集合体703，并且将电阻器集合体703一体地分成 多个芯片电阻器通过冲压使得每个芯片电阻器包括两个电极和结合到两个电极的电阻器部分。
-
Patent Agency Ranking
公开(公告)号：US20220225507A1
公开(公告)日：2022-07-14
申请号：US17710358
申请日：2022-03-31
Applicant: ROHM CO., LTD.
Inventor： Kentaro NAKA
Abstract: [Object]
A method for efficiently manufacturing chip resistors is provided.
[Means]
The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.-
公开(公告)号：US20150155081A1
公开(公告)日：2015-06-04
申请号：US14616307
申请日：2015-02-06
Applicant: ROHM CO., LTD.
Inventor： Torayuki TSUKADA , Kentaro NAKA
IPC: H01C17/00
CPC classification number: H01C17/006 , G01R1/203 , G01R3/00 , H01C1/14 , H01C1/148 , Y10T29/49082 , Y10T156/1075
Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.
Abstract translation: 一种制造片式电阻器的方法包括形成电阻器组件，其中在电阻体部件中设置有包括沿第一方向彼此分离的部分的导电部件; 并且将电阻器组件分成片状电阻器，每个芯片电阻器包括由电阻体部件的一部分形成的芯片形电阻体，由导电部件的一部分形成并在第一方向上彼此分离的一对主电极， 以及一对副电极，其由导电部件的一部分形成，在与第一方向正交的第二方向上在第一方向上彼此分离并且与主电极相邻，并且在第一方向上凹入凹部 ，穿孔。
-
公开(公告)号：US20210144857A1
公开(公告)日：2021-05-13
申请号：US17157512
申请日：2021-01-25
Applicant: ROHM CO., LTD.
Inventor： Kentaro NAKA
Abstract: [Object] A method for efficiently manufacturing chip resistors is provided.
[Means] The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.-
7.发明申请公开(公告)号：US20190208639A1
公开(公告)日：2019-07-04
申请号：US16298636
申请日：2019-03-11
Applicant: ROHM CO., LTD.
Inventor： Kentaro NAKA
CPC classification number: H05K1/181 , H01C1/01 , H01C1/14 , H01C17/006 , H01C17/28 , H01C17/281 , H05K2201/10022 , Y10T29/49082
Abstract: [Object]A method for efficiently manufacturing chip resistors is provided.[Means]The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.
-
公开(公告)号：US20130187749A1
公开(公告)日：2013-07-25
申请号：US13733349
申请日：2013-01-03
Applicant: ROHM CO., LTD.
Inventor： Torayuki TSUKADA , Kentaro NAKA
CPC classification number: H01C17/006 , G01R1/203 , G01R3/00 , H01C1/14 , H01C1/148 , Y10T29/49082 , Y10T156/1075
Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.015 seconds)
