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公开(公告)号：US20180108459A1
公开(公告)日：2018-04-19
申请号：US15842210
申请日：2017-12-14
Applicant: ROHM CO., LTD.
Inventor： Kenichi HARADA , Masaki YONEDA
CPC classification number: H01C1/14 , H01C17/006 , H01C17/06 , H01C17/283 , Y10T29/49082
Abstract: A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge.
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公开(公告)号：US20170287602A1
公开(公告)日：2017-10-05
申请号：US15629400
申请日：2017-06-21
Applicant: ROHM CO., LTD.
Inventor： Kenichi HARADA , Masaki YONEDA
CPC classification number: H01C1/14 , H01C17/006 , H01C17/06 , H01C17/283 , Y10T29/49082
Abstract: A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge.
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公开(公告)号：US20140240083A1
公开(公告)日：2014-08-28
申请号：US14189395
申请日：2014-02-25
Applicant: ROHM CO., LTD.
Inventor： Kenichi HARADA , Masaki YONEDA
CPC classification number: H01C17/006 , H01C1/08 , H01C1/14 , Y10T29/49099 , Y10T156/10
Abstract: A chip resistor includes an insulating substrate, a resistor element arranged on the obverse surface of the substrate, a bonding layer provided between the resistor element and the substrate, a first electrode connected to the resistor element, and a second electrode connected to the resistor element. The second electrode is deviated from the first electrode in a direction perpendicular to the thickness direction of the substrate. The substrate includes a side surface between the obverse surface and the reverse surface. The first electrode covers the resistor element, and also the side surface and the reverse surface of the substrate.
Abstract translation: 芯片电阻器包括绝缘基板，布置在基板的正面上的电阻元件，设置在电阻元件和基板之间的接合层，连接到电阻元件的第一电极和连接到电阻元件的第二电极 。 第二电极在与基板的厚度方向垂直的方向上偏离第一电极。 基板包括在正面和反面之间的侧面。 第一电极覆盖电阻元件，以及衬底的侧表面和反面。
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公开(公告)号：US20230282396A1
公开(公告)日：2023-09-07
申请号：US18311085
申请日：2023-05-02
Applicant: ROHM CO., LTD.
Inventor： Masaki YONEDA
CPC classification number: H01C1/012 , H01C1/014 , H01C1/028 , H01C1/14 , H01C1/142 , H01C3/12 , H05K3/3442
Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
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公开(公告)号：US20170186516A1
公开(公告)日：2017-06-29
申请号：US15456879
申请日：2017-03-13
Applicant: ROHM CO., LTD.
Inventor： Masaki YONEDA
CPC classification number: H01C1/012 , H01C1/014 , H01C1/028 , H01C1/14 , H01C1/142 , H01C3/12 , H05K1/181 , H05K3/3442 , H05K2201/10022 , H05K2201/10636 , Y02P70/611
Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
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Patent Agency Ranking
公开(公告)号：US20170048983A1
公开(公告)日：2017-02-16
申请号：US15340634
申请日：2016-11-01
Applicant: ROHM CO., LTD.
Inventor： Masaki YONEDA
CPC classification number: H05K1/185 , H01C1/012 , H01C1/142 , H01C7/003 , H01C17/006 , H01C17/02 , H01C17/281 , H05K1/113 , H05K2201/10022
Abstract: [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.
Abstract translation: 为了提供激光照射不需要极高位置精度的片式电阻器，并且设置在基座上并且与电阻元件相邻的镀层可以连接到外部导电层。 [解决方案]芯片电阻器包括基底1，第一主面电极21，与第一主面电极21沿第一方向X1隔开的第二主面电极，与第一主面电极接触的电阻体4 21和第二主表面电极31，覆盖电阻元件4，第一主表面电极21和第二主表面电极的外涂层6，覆盖第一主表面电极21和外涂层6的第一辅助电极25和 覆盖第一辅助电极25的第一电镀电极27.第一辅助电极25包括从第一主表面电极21沿第一方向X1偏移的部分259。
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公开(公告)号：US20200176152A1
公开(公告)日：2020-06-04
申请号：US16780431
申请日：2020-02-03
Applicant: ROHM CO., LTD.
Inventor： Masaki YONEDA
Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
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公开(公告)号：US20160042844A1
公开(公告)日：2016-02-11
申请号：US14886943
申请日：2015-10-19
Applicant: ROHM CO., LTD.
Inventor： Kenichi HARADA , Masaki YONEDA
IPC: H01C1/14
CPC classification number: H01C1/14 , H01C17/006 , H01C17/06 , H01C17/283 , Y10T29/49082
Abstract: A chip resistor includes first and second electrodes spaced apart from each other, a resistor element arranged on the first and the second electrodes, a bonding layer provided between the resistor element and the two electrodes, and a plating layer electrically connected to the resistor element. The first electrode includes a flat outer side surface, and the resistor element includes a side surface facing in the direction in which the thirst and the second electrodes are spaced. The outer side surface of the first electrode is flush with the side surface of the resistor element. The plating layer covers at least a part of the outer side surface of the first electrode in a manner such that the covering portion of the plating layer extends from one vertical edge of the outer side surface to the other vertical edge.
Abstract translation: 芯片电阻器包括彼此间隔开的第一和第二电极，布置在第一和第二电极上的电阻器元件，设置在电阻元件和两个电极之间的接合层，以及电连接到电阻元件的镀层。 第一电极包括平坦的外侧表面，并且电阻元件包括面向第一电极和第二电极间隔开的方向的侧表面。 第一电极的外侧表面与电阻元件的侧表面齐平。 镀层以使得镀层的覆盖部分从外侧表面的一个垂直边缘延伸到另一个垂直边缘的方式覆盖第一电极的外侧表面的至少一部分。
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公开(公告)号：US20150022312A1
公开(公告)日：2015-01-22
申请号：US14323633
申请日：2014-07-03
Applicant: ROHM CO., LTD.
Inventor： Masaki YONEDA
IPC: H01C1/012
CPC classification number: H01C1/012
Abstract: A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.
Abstract translation: 芯片电阻器包括电阻器板，第一电极，第二电极和绝缘层。 第二电极在垂直于电阻器板的厚度方向的横向方向上偏离第一电极。 电阻器基板的正面包括与第一电极接触的第一区域，与第二电极接触的第二区域和与绝缘层接触的中间区域。 中间区域在横向方向上设置在第一区域和第二区域之间。 第一电极包括第一下层和第一镀层。 第一底层在电阻器板的厚度方向上设置在第一镀层和绝缘层之间。
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公开(公告)号：US20140367153A1
公开(公告)日：2014-12-18
申请号：US14294477
申请日：2014-06-03
Applicant: ROHM CO., LTD.
Inventor： Masaki YONEDA
CPC classification number: H01C1/012 , H01C1/014 , H01C1/028 , H01C1/14 , H01C1/142 , H01C3/12 , H05K1/181 , H05K3/3442 , H05K2201/10022 , H05K2201/10636 , Y02P70/611
Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.
Abstract translation: 提供了具有减小厚度的片式电阻器。 芯片电阻器包括绝缘衬底，嵌入衬底中的电阻器，电连接到电阻器的第一电极和电连接到电阻器的第二电极。 第一电极和第二电极在垂直于衬底的厚度方向的横向彼此间隔开。
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