公开(公告)号：US20170034916A1

公开(公告)日：2017-02-02

申请号：US15180854

申请日：2016-06-13

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Yasuhiro FUWA ,  Hideaki YANAGIDA ,  Takafumi OKADA

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K3/30

Abstract: A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.

Abstract translation: 多芯片模块包括多个芯片部件，每个芯片部分具有电极，用于密封多个芯片部件的密封树脂，以及固定到密封树脂的外部连接端子，以从外部表面露出 密封树脂并且电连接到至少一个芯片部分的电极。