公开(公告)号：US20160087027A1

公开(公告)日：2016-03-24

申请号：US14956939

申请日：2015-12-02

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Yasuhiro FUWA ,  Hiroyuki OKADA ,  Eiji NUKAGA ,  Katsuya MATSUURA

IPC: H01L49/02 ,  H01L21/3065

CPC classification number: H01L28/20 ,  H01C1/14 ,  H01C13/02 ,  H01C17/006 ,  H01C17/242 ,  H01L21/3065 ,  H01L21/3083 ,  H01L27/0676 ,  H01L27/0802 ,  H05K3/3431 ,  H05K2201/10674

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

Abstract translation: 希望能够以相同的设计结构容易地容纳多种类型的所需电阻值的紧凑且精细的芯片电阻器。 芯片电阻被布置成在基板上具有电阻网络。 电阻网络包括排列成矩阵并具有相等电阻值的多个电阻体。 多个电阻单元分别由电气连接的一个或多个电阻体排列。 多种类型的电阻单元使用连接导体膜和熔丝膜以预定模式连接。 通过选择性地熔断保险膜，可以将电阻单元电连接到电阻网络中或与电阻网络电隔离，使电阻网络的电阻值成为所需的电阻值。

公开(公告)号：US20180158696A1

公开(公告)日：2018-06-07

申请号：US15884926

申请日：2018-01-31

Applicant: ROHM CO., LTD.

Inventor： Yuichi NAKAO ,  Yasuhiro FUWA

IPC: H01L21/52 ,  H01L23/31 ,  H01L23/498 ,  H01L23/13 ,  H01L21/56 ,  H01L25/16 ,  H01L23/14

CPC classification number: H01L21/52 ,  H01L21/56 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3121 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15151 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/15333

Abstract: A semiconductor device is provided with a substrate made of a semiconductor material, an interconnect layer, at least one electronic element, and a sealing resin. The substrate has a main surface and a pair of lateral surfaces that are orthogonal to the main surface and face in opposite directions to each other. A recessed portion that is recessed from the main surface and has an opening portion that opens on at least one of the pair of lateral surfaces is formed in the substrate. The interconnect layer is formed on the substrate. The electronic element is an orientation sensor, for example, and is accommodated in the recessed portion of the substrate. The sealing resin covers the electronic element.

公开(公告)号：US20160187433A1

公开(公告)日：2016-06-30

申请号：US14965312

申请日：2015-12-10

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA ,  Yasuhiro FUWA

IPC: G01R33/06 ,  G01R33/00

CPC classification number: G01R33/063 ,  G01R33/0052 ,  G01R33/0354

Abstract: Provided is a magnetism detection device by which it is possible to achieve a reduction in size and an increase in accuracy. A magnetism detection device includes: a magneto-impedance element; a magnetic field direction changing body; and a substrate that is formed of a semiconductor material and has an element arrangement recessed portion bottom surface and a back surface that face mutually opposite sides in a thickness direction, and a through-hole that reaches the element arrangement recessed portion bottom surface and the back surface and has a cross-sectional dimension that increases toward the main surface starting from the element arrangement recessed portion bottom surface. The magneto-impedance element is mounted on the element arrangement recessed portion bottom surface, and the magnetic field direction changing body is accommodated in the through-hole.

Abstract translation: 提供一种能够实现尺寸减小和精度提高的磁检测装置。 磁检测装置包括：磁阻元件; 磁场方向变换体; 以及由半导体材料形成的基板，具有在厚度方向上彼此相对的两侧面的元件排列凹部底面和背面，以及到达元件排列凹部底面和背面的贯通孔 并且具有从元件布置凹部底面开始朝向主表面增大的横截面尺寸。 磁阻抗元件安装在元件布置凹部底面上，磁场方向改变体容纳在通孔中。

公开(公告)号：US20140284731A1

公开(公告)日：2014-09-25

申请号：US14224489

申请日：2014-03-25

Applicant: ROHM CO., LTD.

Inventor： Yuichi NAKAO ,  Yasuhiro FUWA

IPC: H01L23/495

CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  B81B2203/0315 ,  H01L23/13 ,  H01L23/147 ,  H01L23/24 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49579 ,  H01L23/49816 ,  H01L23/49827 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/157 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate that is made of a semiconductor material and has a main surface formed with a recess. The semiconductor device also includes a wiring layer formed on the substrate, an electronic element housed in the recess, and a sealing resin covering at least a part of the electronic element.

Abstract translation: 半导体器件包括由半导体材料制成并具有形成有凹部的主表面的衬底。 半导体器件还包括形成在基板上的布线层，容纳在凹部中的电子元件以及覆盖电子元件的至少一部分的密封树脂。

公开(公告)号：US20190148480A1

公开(公告)日：2019-05-16

申请号：US16250453

申请日：2019-01-17

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Yasuhiro FUWA ,  Hiroyuki OKADA ,  Eiji NUKAGA ,  Katsuya MATSUURA

IPC: H01L49/02 ,  H01L21/3065 ,  H01L21/308 ,  H01C13/02 ,  H01C1/14 ,  H01L27/06 ,  H01L27/08

Abstract: [Theme] A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

公开(公告)号：US20180019177A1

公开(公告)日：2018-01-18

申请号：US15646311

申请日：2017-07-11

Applicant: ROHM CO., LTD.

Inventor： Yusuke HARADA ,  Yasuhiro FUWA

IPC: H01L23/36 ,  H01L21/768 ,  H01L23/29 ,  H01L23/498

CPC classification number: H01L23/36 ,  H01L21/486 ,  H01L21/76871 ,  H01L23/13 ,  H01L23/29 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389

Abstract: An electronic component includes a substrate having a principal surface, a chip arranged at the principal surface of the substrate, a sealing resin sealing the chip on the principal surface of the substrate, and a heat dissipation member formed on the sealing resin.

公开(公告)号：US20170365655A1

公开(公告)日：2017-12-21

申请号：US15647592

申请日：2017-07-12

Applicant: ROHM CO., LTD.

Inventor： Hiroshi TAMAGAWA ,  Yasuhiro KONDO ,  Yasuhiro FUWA ,  Hiroyuki OKADA ,  Eiji NUKAGA ,  Katsuya MATSUURA

IPC: H01L49/02 ,  H01C13/02 ,  H01L21/3065 ,  H01L27/08 ,  H01L27/06 ,  H01L21/308 ,  H01C1/14 ,  H05K3/34 ,  H01C17/00 ,  H01C17/242

CPC classification number: H01L28/20 ,  H01C1/14 ,  H01C13/02 ,  H01C17/006 ,  H01C17/242 ,  H01L21/3065 ,  H01L21/3083 ,  H01L27/0676 ,  H01L27/0802 ,  H05K3/3431 ,  H05K2201/10674

Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.

公开(公告)号：US20170182794A1

公开(公告)日：2017-06-29

申请号：US15386884

申请日：2016-12-21

Applicant: ROHM CO., LTD.

Inventor： Isamu NISHIMURA ,  Yasuhiro FUWA

IPC: B41J2/335 ,  B41J2/34

CPC classification number: B41J2/33595 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3353 ,  B41J2/33535 ,  B41J2/3354 ,  B41J2/33545 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/34

Abstract: A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

公开(公告)号：US20170034916A1

公开(公告)日：2017-02-02

申请号：US15180854

申请日：2016-06-13

Applicant: ROHM CO., LTD.

Inventor： Mamoru YAMAGAMI ,  Yasuhiro FUWA ,  Hideaki YANAGIDA ,  Takafumi OKADA

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02 ,  H05K3/30

Abstract: A multi-chip module includes a plurality of chip parts with each chip part having an electrode, a sealing resin for sealing the plurality of chip parts, and an external connection terminal secured to the sealing resin so as to be exposed from the outer surface of the sealing resin and electrically connected to the electrode of at least one of the chip parts.

Abstract translation: 多芯片模块包括多个芯片部件，每个芯片部分具有电极，用于密封多个芯片部件的密封树脂，以及固定到密封树脂的外部连接端子，以从外部表面露出 密封树脂并且电连接到至少一个芯片部分的电极。

公开(公告)号：US20190244763A1

公开(公告)日：2019-08-08

申请号：US16385876

申请日：2019-04-16

Applicant: ROHM CO., LTD.

Inventor： Hiroyuki OKADA ,  Yasuhiro FUWA

IPC: H01G5/011 ,  H01G4/38 ,  H01L49/02 ,  H01L27/01 ,  H01G5/38 ,  H01G4/40 ,  H01G4/33 ,  H01G4/015

Abstract: A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.