公开(公告)号：US10035189B2

公开(公告)日：2018-07-31

申请号：US14476291

申请日：2014-09-03

Applicant: ROLLS-ROYCE PLC

Inventor： John Harold Boswell ,  Daniel Clark

IPC: B22F3/12 ,  B22F3/15

CPC classification number: B22F3/1291 ,  B22F3/1241 ,  B22F3/1266 ,  B22F3/1283 ,  B22F3/15 ,  B22F2003/153 ,  Y10T29/49826 ,  Y10T29/49963

Abstract: A method and apparatus for removing a canister 12 from a component 18 by forming an opening 30 in the canister wall thickness 14, 16 and introducing a pressurised fluid into the opening 14, 16 causing hydrostatic pressure build up between an internal canister surface 14 and the component 18, leading to the removal of the canister 12. This method and apparatus obviates the need to expend significant machining or chemical processing to remove the canister 12.

公开(公告)号：US10399143B2

公开(公告)日：2019-09-03

申请号：US14729912

申请日：2015-06-03

Applicant: ROLLS-ROYCE PLC

Inventor： John Harold Boswell ,  Terence Ivan Simpson ,  Phillip John Crosby

IPC: B22D27/04 ,  B22C9/04 ,  B22D25/02 ,  B22D25/06 ,  F01D5/14

Abstract: A method includes forming a mold, the mold having at least one mold portion defining the shape of an element to be removed from the component in a subsequent manufacturing step and having a reduced cross-sectional area. The at least one mold portion includes at least one recess which further reduces the cross sectional area of the cavity and increases the surface area of the at least one mold portion or the at least one mold portion includes a plurality of projections which increase the surface area of the least one mold portion thereby increasing radiative heat loss from the at least one mold portion during the process. A mold for use in this method and a turbine blade formed using this method, are also provided.

公开(公告)号：US09352412B2

公开(公告)日：2016-05-31

申请号：US14156923

申请日：2014-01-16

Applicant: ROLLS-ROYCE PLC

Inventor： John Harold Boswell ,  Daniel Clark ,  Charles Richard Carpenter ,  Andrew Richard Kennedy

IPC: B23K15/00 ,  B23K26/21 ,  B23K26/346 ,  B23K28/02 ,  B32B15/01 ,  B23K15/06 ,  B23K26/20 ,  B23K20/02

CPC classification number: B23K15/0006 ,  B23K15/0046 ,  B23K15/06 ,  B23K20/021 ,  B23K26/21 ,  B23K26/211 ,  B23K26/346 ,  B23K28/02 ,  B32B15/01 ,  Y10T428/12493

Abstract: A method of forming a bonded assembly (10). The method comprises: providing at least first and second parts (12, 14) of an assembly (10) to be bonded; assembling the first and second parts (12, 14) in a required relative position to define a bond interface region therebetween; sealing part way along an edge (18) of the bond interface region using laser beam welding to define a cavity between the first and second parts (12, 14); in a vacuum environment, sealing the remainder of the edge (20) of the bond interface region using electron beam welding to form a fluid tight seal around the cavity; and applying heat and pressure to an external surface of the cavity to diffusion bond the first and second parts (12, 14) together.

Abstract translation: 一种形成接合组件（10）的方法。 该方法包括：提供待接合的组件（10）的至少第一和第二部分（12,14）; 将第一和第二部分（12,14）组装在所需的相对位置以限定它们之间的接合界面区域; 使用激光束焊接沿着所述接合界面区域的边缘（18）密封部分路径，以在所述第一和第二部分（12,14）之间限定空腔; 在真空环境中，使用电子束焊接密封接合界面区域的边缘（20）的其余部分，以在腔体周围形成流体密封; 以及将热和压力施加到所述空腔的外表面以将所述第一和第二部分（12,14）扩散连接在一起。