公开(公告)号：US5622303A

公开(公告)日：1997-04-22

申请号：US429715

申请日：1995-04-27

Applicant: Rainer Worthmann

Inventor： Rainer Worthmann

IPC: B23K1/08 ,  H05K3/34 ,  B23K3/06

CPC classification number: B23K1/08 ,  H05K3/3468 ,  B23K2201/36 ,  H05K2203/1581

Abstract: The method and the device serve for soldering of workpieces, namely of pc boards and substrates, which are equipped with chip component parts and/or microelements and/or assemblies comprised thereof. Such boards are passed through a main solder bath or at least one main solder wave, and the workpiece is contacted with the surface of the wave. The solder wave has an imaginary break edge 2, i.e., a break edge at which the solder loses the contact with the workpiece in connection with an unwettable workpiece. The imaginary break edge 2 of the soldering device 1 extends not in a straight line and, viewed in the direction of conveyance 3, has at least one diminution 4, i.e., two edge parts ending in a point, i.e., the edges form a triangle.

Abstract translation: 该方法和装置用于焊接装配有芯片部件和/或微元件和/或其组件的组件的印刷电路板和基板的工件。 这样的板通过主焊锡槽或至少一个主焊波，并且工件与波的表面接触。 焊波具有假想断裂边缘2，即断裂边缘，在该断裂边缘处焊料与不可接受的工件相连接失去与工件的接触。 焊接装置1的虚假断裂边缘2不是以直线延伸，并且从输送方向3看，具有至少一个减少部分4，即以一个点终止的两个边缘部分，即边缘形成三角形 。