Device and method used for measuring wafers

    公开(公告)号:US12033901B2

    公开(公告)日:2024-07-09

    申请号:US17290706

    申请日:2019-11-01

    发明人: Bin Li Haijun Gao

    摘要: The present disclosure relates to a device and method for measuring wafers. The device comprises: a moving platform, which is used to adjust the location of wafers; a first pre-alignment module and a first image recognition module, which are used to align a first wafer at a first location on the moving platform before measuring the first wafer; a second pre-alignment module and a second image recognition module, which are used to align a second wafer at a second location on the moving platform before measuring the second wafer; and a measurement module, which is used to measure the first wafer and the second wafer at a third location on the moving platform, wherein the first location, second location and third location are different from each other. The embodiments of the present disclosure may improve the measurement efficiency of the device.

    Calibrating method and device for broad-band achromatic composite wave plate and corresponding measurement system

    公开(公告)号:US10309834B2

    公开(公告)日:2019-06-04

    申请号:US15570557

    申请日:2016-04-14

    IPC分类号: G01J4/04 G01M11/02

    摘要: The present disclosure discloses a calibrating method, apparatus, and corresponding measurement system for a composite waveplate. The calibrating method comprises: A. determining a first matrix characterizing the composite waveplate, the first matrix including at least one unknown number; B. determining a theoretical relationship between a light intensity and an alignment angle offset value of the composite waveplate based on the first matrix; and C. calibrating based on the theoretical relationship between a light intensity and an alignment angle offset value of the composite waveplate determined in step (B) and actually measured light intensity data to obtain a second matrix that may characterize the composite waveplate and does not contain the unknown number. The technical solution of the present disclosure may greatly reduce the amount of unknown numbers when calibrating a composite waveplate or a measuring system, thereby lowering the difficulty of calibration and improving the precision of calibration.