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    Device and method used for measuring wafers
    1.
    发明授权
    Device and method used for measuring wafers 有权

    公开(公告)号：US12033901B2

    公开(公告)日：2024-07-09

    申请号：US17290706

    申请日：2019-11-01

    申请人： Raintree Scientific Instruments (Shanghai) Corporation

    发明人： Bin Li ,  Haijun Gao

    IPC分类号： H01L21/12 ,  H01L21/66 ,  H01L21/67 ,  H01L21/68

    CPC分类号： H01L22/12 ,  H01L21/67253 ,  H01L21/681

    摘要： The present disclosure relates to a device and method for measuring wafers. The device comprises: a moving platform, which is used to adjust the location of wafers; a first pre-alignment module and a first image recognition module, which are used to align a first wafer at a first location on the moving platform before measuring the first wafer; a second pre-alignment module and a second image recognition module, which are used to align a second wafer at a second location on the moving platform before measuring the second wafer; and a measurement module, which is used to measure the first wafer and the second wafer at a third location on the moving platform, wherein the first location, second location and third location are different from each other. The embodiments of the present disclosure may improve the measurement efficiency of the device.

    SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTRODE STRUCTURE
    2.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING A SUPPORT PATTERN ON A LOWER ELECTRODE STRUCTURE 有权

    公开(公告)号：US20220328303A1

    公开(公告)日：2022-10-13

    申请号：US17851244

    申请日：2022-06-28

    申请人： Samsung Electronics Co., Ltd.

    发明人： Hyun-Suk Lee ,  Jungoo Kang ,  Gihee Cho ,  Sanghyuck Ahn

    IPC分类号： H01L21/02 ,  H01L21/302 ,  H01L21/12 ,  H01L21/768

    摘要： Semiconductor devices are provided. A semiconductor device includes a first portion of a lower electrode structure on a substrate. The semiconductor device includes a first support pattern being in contact with a first portion of a sidewall of the first portion of the lower electrode structure. The semiconductor device includes a second portion of the lower electrode structure on a second portion of the sidewall of the first portion of the lower electrode structure. The semiconductor device includes an upper electrode on the second portion of the lower electrode structure and on the first support pattern. Moreover, the semiconductor device includes a dielectric layer between the upper electrode and the second portion of the lower electrode structure.

    Methods for forming fins
    4.
    发明授权
    Methods for forming fins 有权

    公开(公告)号：US10276374B2

    公开(公告)日：2019-04-30

    申请号：US15709730

    申请日：2017-09-20

    申请人： GLOBALFOUNDRIES INC.

    发明人： Jiehui Shu ,  Garo J. Derderian ,  Jinping Liu

    IPC分类号： H01L21/12 ,  H01L21/033 ,  H01L21/8234 ,  H01L27/06 ,  H01L27/092 ,  H01L29/66 ,  H01L21/8238 ,  H01L27/088 ,  H01L27/12

    摘要： The disclosure is directed to methods for forming a set of fins from a substrate. One embodiment of the disclosure includes: providing a stack over the substrate, the stack including a first oxide over the substrate, a first nitride over the pad oxide, a second oxide over the first nitride, and a first hardmask over the second oxide; patterning the first hard mask to form a first set of hardmask fins over the second oxide; oxidizing the first set of hardmask fins to convert the first set of hardmask fins into a set of oxide fins; using the set of oxide fins as a mask, etching the second oxide and the first nitride to expose portions of the first oxide thereunder such that remaining portions of the second oxide and the first nitride remain disposed beneath the set of oxide fins thereby defining a set of mask stacks; and using the set of mask stacks as a mask, etching the exposed portions of the first oxide and the substrate thereby forming the set of fins from the substrate.

    Touch panel and electronic device
    6.
    发明授权
    Touch panel and electronic device 有权
    触摸屏和电子设备

    公开(公告)号：US09389720B2

    公开(公告)日：2016-07-12

    申请号：US14470967

    申请日：2014-08-28

    申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    发明人： Yoshiyuki Kurokawa ,  Konami Izumi

    IPC分类号： G06F3/041 ,  G06F3/042 ,  G02F1/1333 ,  G09G3/36 ,  B81B3/00 ,  H01L21/12 ,  H01L27/144 ,  H01L27/12

    CPC分类号： G06F3/0421 ,  B81B3/0021 ,  B81B2201/0264 ,  G02F1/13338 ,  G02F2201/44 ,  G06F3/0412 ,  G06F3/0416 ,  G06F3/042 ,  G09G3/3648 ,  H01L27/1225 ,  H01L27/1446

    摘要： To provide a touch panel with reduced disturbance of display and with improved mechanical strength by suppressing variation in the space between a pair of substrates which form the touch panel even when in contact with an object to be detected. A pixel portion including a plurality of pixels is provided between a pair of substrates. Each pixel includes a photosensor portion which detects that the object to be detected is in contact with one of the pair of substrates, and a MEMS portion which generates a mechanical displacement in a direction perpendicular to the pair of substrates when a signal based on a detection result of the photosensor portion is input.

    摘要翻译： 通过抑制形成触摸面板的一对基板之间的空间的变化，即使在与被检测物接触的情况下，也能够提供具有降低的显示干扰和改善的机械强度的触摸面板。 包括多个像素的像素部分设置在一对基板之间。 每个像素包括光电传感器部分，其检测待检测对象与一对基板中的一个接触;以及MEMS部分，当基于检测的信号时，在垂直于该对基板的方向上产生机械位移的MEMS部分 输入光电传感器部分的结果。

    Fabricating method of semiconductor device
    7.
    发明授权
    Fabricating method of semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号：US08673658B2

    公开(公告)日：2014-03-18

    申请号：US13769824

    申请日：2013-02-19

    申请人： Industrial Technology Research Institute

    发明人： Ming-Che Hsieh ,  John H. Lau ,  Ra-Min Tain

    IPC分类号： H01L21/12

    CPC分类号： H01L22/12 ,  G01N19/04 ,  H01L2224/16

    摘要： A fabricating method and a testing method of a semiconductor device and a mechanical integrity testing apparatus are provided. An object includes a wafer, an insulating layer, and a plurality of conductive posts is provided. A surface of the wafer has a plurality of first blind holes outside chip regions and a plurality of second blind holes inside the chip regions. The insulating layer is between the conductive posts and the walls of the first blind holes and between the conductive posts and the walls of the second blind holes. A mechanical integrity test is performed to test a binding strength between the insulating layer, the conductive posts, and the walls of the first blind holes. The conductive posts in the chip regions are electrically connected to an element after the conductive posts in the first blind holes are qualified in the mechanical integrity test.

    摘要翻译： 提供了半导体器件和机械完整性测试装置的制造方法和测试方法。 一种物体包括晶片，绝缘层和多个导电柱。 晶片的表面在芯片区域外部具有多个第一盲孔和芯片区域内的多个第二盲孔。 绝缘层位于导电柱和第一盲孔的壁之间以及导电柱和第二盲孔的壁之间。 执行机械完整性测试以测试绝缘层，导电柱和第一盲孔的壁之间的结合强度。 在机械完整性测试中，在第一盲孔中的导电柱合格之后，芯片区域中的导电柱电连接到元件。

    Gap-filling composition with excellent shelf life by end-capping
    8.
    发明授权
    Gap-filling composition with excellent shelf life by end-capping 有权
    间隙填充组合物，通过封端具有优良的保存期限

    公开(公告)号：US08642437B2

    公开(公告)日：2014-02-04

    申请号：US12659908

    申请日：2010-03-25

    申请人： Chang Soo Woo ,  Hee Jae Kim ,  Sung Jae Lee ,  Sang Geun Yun ,  Tae Ho Kim

    发明人： Chang Soo Woo ,  Hee Jae Kim ,  Sung Jae Lee ,  Sang Geun Yun ,  Tae Ho Kim

    IPC分类号： H01L21/12 ,  C08L83/06

    CPC分类号： C08L83/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/70

    摘要： A composition with improved shelf life for filling small gaps in a semiconductor device is provided. The composition comprises an end-capped silicone polymer. The molecular weight of the end-capped silicone polymer is not varied during storage. In addition, the dissolution rate (DR) of the composition in an alkaline developing solution is maintained at a desired level during storage. That is, the composition is highly stable during storage. Therefore, the composition is suitable for use in a node separation process for the fabrication of a semiconductor capacitor.

    摘要翻译： 提供了一种用于填充半导体器件中的小间隙的具有改善的保质期的组合物。 组合物包含封端的硅氧烷聚合物。 封端硅氧烷聚合物的分子量在储存期间不变化。 此外，组合物在碱性显影液中的溶解速率（DR）在储存期间保持在期望的水平。 也就是说，组合物在储存期间高度稳定。 因此，该组合物适用于制造半导体电容器的节点分离工艺。