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1.发明授权Power electronic package having two substrates with multiple semiconductor chips and electronic components 有权具有两个具有多个半导体芯片和电子部件的基板的电力电子封装公开(公告)号：US07999369B2
公开(公告)日：2011-08-16
申请号：US11511516
申请日：2006-08-29
IPC分类号： H01L23/48
CPC分类号： H01L23/49844 , H01L23/5385 , H01L24/31 , H01L24/83 , H01L25/072 , H01L25/18 , H01L2224/33 , H01L2224/81894 , H01L2224/83801 , H01L2224/83894 , H01L2924/01079 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/00
摘要： A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.
摘要翻译： 电力电子封装包括：第一和第二高导热绝缘非平面基板; 以及基板之间的多个半导体芯片和电子部件。 每个衬底包括多个电绝缘体层和连接到电子部件的图案化电导体层，并且还包括多个凸起区域或柱体，这些凸起区域或柱体被结合在一起，使得衬底机械地和电连接。 调整凸起区域或柱的数量，布置和形状以在基板之间具有机械分离。 电导体层彼此分离和隔离，使得在至少一个基板上设置多个电路。
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2.发明授权Power electronic package having two substrates with multiple semiconductor chips and electronic components 有权具有两个具有多个半导体芯片和电子部件的基板的电力电子封装公开(公告)号：US08432030B2
公开(公告)日：2013-04-30
申请号：US13171788
申请日：2011-06-29
IPC分类号： H01L23/48
CPC分类号： H01L23/49844 , H01L23/5385 , H01L24/31 , H01L24/83 , H01L25/072 , H01L25/18 , H01L2224/33 , H01L2224/81894 , H01L2224/83801 , H01L2224/83894 , H01L2924/01079 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/00
摘要： A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.
摘要翻译： 电力电子封装包括：第一和第二高导热绝缘非平面基板; 以及基板之间的多个半导体芯片和电子部件。 每个衬底包括多个电绝缘体层和连接到电子部件的图案化电导体层，并且还包括多个凸起区域或柱体，这些凸起区域或柱体被结合在一起，使得衬底机械地和电连接。 调整凸起区域或柱的数量，布置和形状以在基板之间具有机械分离。 电导体层彼此分离和隔离，使得在至少一个基板上设置多个电路。
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3.发明申请Power electronic package having two substrates with multiple semiconductor chips and electronic components 有权具有两个具有多个半导体芯片和电子部件的基板的电力电子封装公开(公告)号：US20080054439A1
公开(公告)日：2008-03-06
申请号：US11511516
申请日：2006-08-29
IPC分类号： H01L23/48
CPC分类号： H01L23/49844 , H01L23/5385 , H01L24/31 , H01L24/83 , H01L25/072 , H01L25/18 , H01L2224/33 , H01L2224/81894 , H01L2224/83801 , H01L2224/83894 , H01L2924/01079 , H01L2924/12032 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/00
摘要： A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates.
摘要翻译： 电力电子封装包括：第一和第二高导热绝缘非平面基板; 以及基板之间的多个半导体芯片和电子部件。 每个衬底包括多个电绝缘体层和连接到电子部件的图案化电导体层，并且还包括多个凸起区域或柱体，这些凸起区域或柱体被结合在一起，使得衬底机械地和电连接。 调整凸起区域或柱的数量，布置和形状以在基板之间具有机械分离。 电导体层彼此分离和隔离，使得在至少一个基板上设置多个电路。
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