公开(公告)号：US09298228B1

公开(公告)日：2016-03-29

申请号：US14810410

申请日：2015-07-27

Applicant: Rambus Inc.

Inventor： Abhijit M. Abhyankar ,  Ravindranath Kollipara ,  Thomas J. Giovannini ,  Ming Li ,  David A. Secker ,  Arun Vaidyanath ,  Donald R. Mullen ,  Adrian F. Torres

IPC: H05K1/11 ,  H05K1/14 ,  G06F1/18

CPC classification number: G06F1/185

Abstract: A computing system having a memory riser sub-system. The computing system includes a motherboard with a memory module connector and a riser card inserted into the first memory module connector. A first mezzanine card is connected to the riser card. The first mezzanine card includes a first mezzanine memory module connector for a first memory module and a second mezzanine memory module connector for a second memory module. A memory channel electrically connects the memory controller to the first mezzanine memory module connector and the second mezzanine module connector via the motherboard, the first riser card and the first mezzanine card. The memory channel may be divided into a first data sub-channel connected to the first mezzanine memory module connector and a second data sub-channel connected to the second mezzanine memory module connector.

Abstract translation: 具有存储器提升子子系统的计算系统。 计算系统包括具有存储器模块连接器的主板和插入到第一存储器模块连接器中的转接卡。 第一个夹层卡连接到转接卡。 第一夹层卡包括用于第一存储器模块的第一夹层存储器模块连接器和用于第二存储器模块的第二夹层存储器模块连接器。 存储通道经由主板，第一转接卡和第一夹层卡将存储器控制器电连接到第一夹层存储器模块连接器和第二夹层模块连接器。 存储器通道可以被分成连接到第一夹层存储器模块连接器的第一数据子通道和连接到第二夹层存储器模块连接器的第二数据子通道。

公开(公告)号：US09841791B2

公开(公告)日：2017-12-12

申请号：US14568880

申请日：2014-12-12

Applicant: Rambus Inc.

Inventor： Donald R. Mullen ,  Chi-Ming Yeung ,  David A. Secker

IPC: H05K1/14 ,  G06F1/18 ,  H05K7/14 ,  H05K7/20

CPC classification number: G06F1/183 ,  G06F1/185 ,  H05K1/14 ,  H05K7/1487 ,  H05K7/20409 ,  H05K7/20709

Abstract: A rack unit configuration is described that includes a first printed circuit board (PCB) assembly interleaved with a second PCB assembly that is inverted with respect to the first PCB assembly. The configuration of the first PCB assembly and the second PCB assembly allow for increased component and power densities within computing systems, memory systems, etc. The increased density may be achieved while allowing sufficient mechanical clearance to allow easy component replacement and servicing (e.g., and hot pluggability). Power density may also be increased with PCB assemblies including nested and interleaved power modules.