公开(公告)号：US20230176953A1

公开(公告)日：2023-06-08

申请号：US18059900

申请日：2022-11-29

Applicant: Rambus Inc.

Inventor： Joohee Kim ,  Dongyun Lee

IPC: G06F11/20 ,  H01L23/00 ,  H01L25/065 ,  G11C29/00

CPC classification number: G06F11/2028 ,  H01L24/32 ,  H01L24/16 ,  H01L25/0657 ,  G11C29/816 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2224/32145 ,  H01L2924/15311

Abstract: Described are memory systems and devices in which each memory die in a three-dimensional stack of memory dies includes drive and receive circuitry that can communicate data signals from the stack on behalf of all the memory dies in the stack. The drive and receive circuitry, if defective on one device in the stack, can be disabled and substituted with the drive and receive circuitry from another. The stack of memory dies can thus function despite a failure of drive or receive circuitry in one or more of the memory dies. Each memory die includes test circuitry to detect defective drive and receive circuitry.

公开(公告)号：US12287712B2

公开(公告)日：2025-04-29

申请号：US18059900

申请日：2022-11-29

Applicant: Rambus Inc.

Inventor： Joohee Kim ,  Dongyun Lee

IPC: G11C11/4093 ,  G06F11/20 ,  G11C29/00 ,  H01L23/00 ,  H01L25/065

Abstract: Described are memory systems and devices in which each memory die in a three-dimensional stack of memory dies includes drive and receive circuitry that can communicate data signals from the stack on behalf of all the memory dies in the stack. The drive and receive circuitry, if defective on one device in the stack, can be disabled and substituted with the drive and receive circuitry from another. The stack of memory dies can thus function despite a failure of drive or receive circuitry in one or more of the memory dies. Each memory die includes test circuitry to detect defective drive and receive circuitry.