公开(公告)号：US20070159744A1

公开(公告)日：2007-07-12

申请号：US11326768

申请日：2006-01-06

申请人： Ramen Dutta ,  Chih-Jiann Chen ,  Dan Hariton ,  Jayanta Lahiri ,  May Vijay ,  Mark Sherwood

发明人： Ramen Dutta ,  Chih-Jiann Chen ,  Dan Hariton ,  Jayanta Lahiri ,  May Vijay ,  Mark Sherwood

IPC分类号： H02H9/00

CPC分类号： H01L27/0248 ,  H01L23/60 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00

摘要： An integrated circuit is adapted for dual use in three different ways: 1) it is powered by either of two different low or high voltage sources; 2) it may be connected to the IC package voltage reference pin in two different ways, using either an on-chip internal resistor or an in-package external resistor to limit the voltage/current to the IC; 3) the ESD structures are used not only for their well-known circuit protection function, but also as a conductive path for the high voltage operating source.

摘要翻译： 集成电路适用于以三种不同的方式进行双重使用：1）由两种不同的低压或高压电源供电; 2）可以使用片上内部电阻或封装外部电阻将IC封装电压基准引脚连接到两个不同的方式来限制IC的电压/电流; 3）ESD结构不仅用于其众所周知的电路保护功能，而且还用作高压工作源的导电路径。