公开(公告)号：US07785459B2

公开(公告)日：2010-08-31

申请号：US11420764

申请日：2006-05-28

申请人： Ramesh S/O Govinda Raju ,  Ming-Li Tan ,  Yusua Agabus ,  Patricia A. Beck

发明人： Ramesh S/O Govinda Raju ,  Ming-Li Tan ,  Yusua Agabus ,  Patricia A. Beck

IPC分类号： C25D1/02

CPC分类号： C25D1/02 ,  B82Y30/00 ,  C25D1/10

摘要： Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required. The method according to this embodiment includes: forming a recess with an apex in a substrate; forming a seed layer on the substrate; forming a nonconductive pattern on a portion of the seed layer that is on a sidewall surface of the recess; plating an electrically conductive material over the seed layer and over the edge of the nonconductive pattern to form a plated layer with an opening that exposes a portion of the nonconductive pattern; and separating the plated layer from the seed layer and the nonconductive pattern to release a hollow microneedle with an offset opening.

摘要翻译： 公开了制造微针的低成本方法。 根据一个实施例，制造方法包括以下步骤：提供衬底; 在所述基板的顶表面上形成含金属的种子层; 在种子层的一部分上形成非导电图案; 在种子层上和非导电图案的边缘上镀覆第一金属以产生具有露出非导电图案的一部分的开口的微型金属; 将第二金属镀在微型玻璃上以在开口中形成微针; 用形成在其中的微针从种子层和非导电图案分离微型金属; 并选择性地蚀刻微型金属以便释放微针。 在另一个实施例中，不需要微型显微镜。 根据该实施例的方法包括：在基板中形成具有顶点的凹部; 在所述基板上形成种子层; 在所述种子层的位于所述凹部的侧壁表面上的部分上形成非导电图案; 在种子层上和非导电图案的边缘上镀覆导电材料以形成具有暴露非导电图案的一部分的开口的镀层; 并且将电镀层与种子层和非导电图案分离以释放具有偏移开口的中空微针。

公开(公告)号：US20060226016A1

公开(公告)日：2006-10-12

申请号：US11420764

申请日：2006-05-28

申请人： Ramesh S/O Govinda Raju ,  Ming-Li Tan ,  Yusua Agabus ,  Patricia Beck

发明人： Ramesh S/O Govinda Raju ,  Ming-Li Tan ,  Yusua Agabus ,  Patricia Beck

IPC分类号： C25D5/02

CPC分类号： C25D1/02 ,  B82Y30/00 ,  C25D1/10

摘要： Low cost methods for fabricating microneedles are disclosed. According to one embodiment, the fabrication method includes the steps of: providing a substrate; forming a metal-containing seed layer on the top surface of the substrate; forming a nonconductive pattern on a portion of the seed layer; plating a first metal on the seed layer and over the edge of the nonconductive pattern to create a micromold with an opening that exposes a portion of the nonconductive pattern; plating a second metal onto the micromold to form a microneedle in the opening; separating the micromold with the microneedle formed therein from the seed layer and the nonconductive pattern; and selectively etching the micromold so as to release the microneedle. In another embodiment, the micromold is not required. The method according to this embodiment includes: forming a recess with an apex in a substrate; forming a seed layer on the substrate; forming a nonconductive pattern on a portion of the seed layer that is on a sidewall surface of the recess; plating an electrically conductive material over the seed layer and over the edge of the nonconductive pattern to form a plated layer with an opening that exposes a portion of the nonconductive pattern; and separating the plated layer from the seed layer and the nonconductive pattern to release a hollow microneedle with an offset opening.

摘要翻译： 公开了制造微针的低成本方法。 根据一个实施例，制造方法包括以下步骤：提供衬底; 在所述基板的顶表面上形成含金属的种子层; 在种子层的一部分上形成非导电图案; 在种子层上和非导电图案的边缘上镀覆第一金属以产生具有露出非导电图案的一部分的开口的微型金属; 将第二金属镀在微型玻璃上以在开口中形成微针; 用形成在其中的微针从种子层和非导电图案分离微型金属; 并选择性地蚀刻微型金属以便释放微针。 在另一个实施例中，不需要微型金属。 根据该实施例的方法包括：在基板中形成具有顶点的凹部; 在所述基板上形成种子层; 在所述种子层的位于所述凹部的侧壁表面上的部分上形成非导电图案; 在种子层上和非导电图案的边缘上镀覆导电材料以形成具有暴露非导电图案的一部分的开口的镀层; 并且将电镀层与种子层和非导电图案分离以释放具有偏移开口的中空微针。