公开(公告)号：US06334230B1

公开(公告)日：2002-01-01

申请号：US09758989

申请日：2001-01-12

申请人： Raymond M. Khoury ,  Marc Mattaroccia ,  Jose M. Ocasio

发明人： Raymond M. Khoury ,  Marc Mattaroccia ,  Jose M. Ocasio

IPC分类号： B08B1102

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A wafer cleaning apparatus includes a wafer holding mechanism and a wafer cleaning head; the mechanism contacts the outer edge of the wafer and has a surface substantially flush with the wafer surface. The wafer cleaning head includes a wafer cleaning element, which has a flat surface contacting the wafer surface when cleaning the wafer. The wafer cleaning element may be a brush, a sponge, or other suitable material. A portion of the wafer cleaning element overlies the above-mentioned surface of the wafer holding mechanism when cleaning the edge portion of the wafer. The wafer holding mechanism and wafer cleaning head are shaped to avoid mechanical interference therebetween when the edge portion of the wafer is cleaned. Accordingly, the entire wafer surface, including the area adjacent the edge, may be effectively cleaned.

摘要翻译： 晶片清洗装置包括晶片保持机构和晶圆清洗头; 该机构接触晶片的外边缘并具有与晶片表面基本齐平的表面。 晶片清洁头包括晶片清洁元件，其在清洁晶片时具有与晶片表面接触的平坦表面。 晶片清洁元件可以是刷子，海绵或其它合适的材料。 当清洁晶片的边缘部分时，晶片清洁元件的一部分覆盖晶片保持机构的上述表面。 当清洁晶片的边缘部分时，晶片保持机构和晶片清洁头被成形为避免它们之间的机械干涉。 因此，可以有效地清洁包括邻近边缘的区域的整个晶片表面。

公开(公告)号：US06648979B2

公开(公告)日：2003-11-18

申请号：US09768833

申请日：2001-01-24

申请人： Michael F. Lofaro ,  Marc Mattaroccia ,  Leonard C. Stevens, Jr.

发明人： Michael F. Lofaro ,  Marc Mattaroccia ,  Leonard C. Stevens, Jr.

IPC分类号： B08B700

CPC分类号： H01L21/67046 ,  B08B1/04

摘要： A semiconductor wafer is cleaned while a sponge or brush is pressed against the wafer with a constant forced applied utilizing a bias in a constant force pencil. The wafer is cleaned in the state wherein a collapsing portion of the constant force pencil with respect to the cleaning sponge cloth is set in such a way that the cleaning pressure, which is applied from the cleaning sponge to the wafer, can be constant and is adjustable. A method for cleaning wafers using a constant force pencil is also described.