摘要:
The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement and direction, locally selectable physical protection and shock resistance and electrical shielding. It achieves the packaging benefits by having; a laminated enclosure member structure that has an internal device supporting lamination and an external wear resistant lamination on each side of a layer of a material that has the combined physical properties of selectably interrelated coolant permeability and density, non-corrosiveness and electrical conductivity; heat generating signal processing devices mounted on the internal lamination; positioned holes through the laminations on each side of the permeable material layer that provide entrance, exit and directing openings for a coolant fluid, including air, that is brought in from the outside, and, propelling the coolant at least conventionally by the heat from the signal processing devices and additionally by a separate fan located in the enclosure so that the heated coolant is exhausted to the outside. Localized shock resistance is imparted by selective change in the density of the permeable layer.
摘要:
The invention provides a wiring conductor for densely packed electronic apparatus, on which there is a supporting body of a material with randomly intertwined and fused filaments with spacing for being permeated by a coolant. The filamentary body material in addition may have imparted thereto the physical properties of interdependent density and permeability, noncorrosiveness and electrical conductivity.