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公开(公告)号：US20220244578A1
公开(公告)日：2022-08-04
申请号：US17162860
申请日：2021-01-29
Applicant: Raytheon Company , Raytheon Company
Inventor： Stephen P. Palese , Avram Bar-Cohen
Abstract: An apparatus includes a photonic integrated circuit, which includes at least one splitter configured to split at least one input beam into multiple input beamlets and multiple phase modulators configured to phase-shift at least some of the input beamlets. The apparatus also includes an array of optical amplifiers configured to amplify the phase-shifted input beamlets and generate amplified beamlets. The apparatus further incudes a beam combiner configured to combine the amplified beamlets and generate an output beam. In addition, the apparatus includes a controller configured to control the phase modulators in order to adjust phasing of the phase-shifted input beamlets.
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Patent Agency Ranking
公开(公告)号：US11934048B2
公开(公告)日：2024-03-19
申请号：US17162860
申请日：2021-01-29
Applicant: Raytheon Company
Inventor： Stephen P. Palese , Avram Bar-Cohen
CPC classification number: G02F1/011 , G01J1/4257 , H01S5/02469 , H01S5/041 , H01S5/40 , G02F2203/50
Abstract: An apparatus includes a photonic integrated circuit, which includes at least one splitter configured to split at least one input beam into multiple input beamlets and multiple phase modulators configured to phase-shift at least some of the input beamlets. The apparatus also includes an array of optical amplifiers configured to amplify the phase-shifted input beamlets and generate amplified beamlets. The apparatus further incudes a beam combiner configured to combine the amplified beamlets and generate an output beam. In addition, the apparatus includes a controller configured to control the phase modulators in order to adjust phasing of the phase-shifted input beamlets.
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公开(公告)号：US11476178B2
公开(公告)日：2022-10-18
申请号：US16901922
申请日：2020-06-15
Applicant: Raytheon Company
Inventor： David H. Altman , Susan C. Trulli , Avram Bar-Cohen
IPC: H01L23/367 , H01L21/48 , H01L23/373
Abstract: A system includes at least one component configured to generate thermal energy, a heat spreader configured to remove thermal energy from the at least one component, and at least one substrate configured to remove thermal energy from the heat spreader. The heat spreader includes a first portion and a second portion. The first portion of the heat spreader is coupled to the substrate, and the second portion of the heat spreader is coupled to the at least one component. The first portion of the heat spreader includes high aspect-ratio structures that are separated from one another. The high aspect-ratio structures cause the first portion of the heat spreader to be pliable and able to accommodate a mismatch in coefficients of thermal expansion between a material in the heat spreader and a material in the substrate.
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公开(公告)号：US11459127B2
公开(公告)日：2022-10-04
申请号：US16538002
申请日：2019-08-12
Applicant: Raytheon Company
Inventor： Tuan L. Duong , Avram Bar-Cohen
Abstract: An apparatus includes a structure configured to receive and transport thermal energy. The structure includes one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range. The one or more materials form a heat input region configured to receive the thermal energy and a cold sink interface region configured to reject the thermal energy. The structure also includes one or more thermal energy transfer devices embedded in at least part of the one or more materials. The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region. The one or more materials are also configured to absorb and store excess thermal energy in response to a temperature excursion associated with a thermal transient event and to release the stored thermal energy after the thermal transient event.
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公开(公告)号：US20210028083A1
公开(公告)日：2021-01-28
申请号：US16901922
申请日：2020-06-15
Applicant: Raytheon Company
Inventor： David H. Altman , Susan C. Trulli , Avram Bar-Cohen
IPC: H01L23/367 , H01L23/373 , H01L21/48
Abstract: A system includes at least one component configured to generate thermal energy, a heat spreader configured to remove thermal energy from the at least one component, and at least one substrate configured to remove thermal energy from the heat spreader. The heat spreader includes a first portion and a second portion. The first portion of the heat spreader is coupled to the substrate, and the second portion of the heat spreader is coupled to the at least one component. The first portion of the heat spreader includes high aspect-ratio structures that are separated from one another. The high aspect-ratio structures cause the first portion of the heat spreader to be pliable and able to accommodate a mismatch in coefficients of thermal expansion between a material in the heat spreader and a material in the substrate.
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公开(公告)号：US20200002026A1
公开(公告)日：2020-01-02
申请号：US16538002
申请日：2019-08-12
Applicant: Raytheon Company
Inventor： Tuan L. Duong , Avram Bar-Cohen
Abstract: An apparatus includes a structure configured to receive and transport thermal energy. The structure includes one or more materials configured to undergo a solid-solid phase transformation at a specified temperature or in a specified temperature range. The one or more materials form a heat input region configured to receive the thermal energy and a cold sink interface region configured to reject the thermal energy. The structure also includes one or more thermal energy transfer devices embedded in at least part of the one or more materials. The one or more thermal energy transfer devices are configured to transfer the thermal energy throughout the one or more materials and at least partially between the heat input region and the cold sink interface region. The one or more materials are also configured to absorb and store excess thermal energy in response to a temperature excursion associated with a thermal transient event and to release the stored thermal energy after the thermal transient event.
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