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1.发明授权Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels 有权具有多平面嵌入式流体冷却通道的单片多模块电子机箱公开(公告)号：US09468131B2
公开(公告)日：2016-10-11
申请号：US14254518
申请日：2014-04-16
Applicant: Raytheon Company
Inventor： David B. Brandt , Robert K. Dodds , David W. Chu , Alicia G. Allen , Gregory P. Schaefer
CPC classification number: H05K7/20218 , H05K7/20254 , H05K7/20636 , H05K13/00
Abstract: A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.
Abstract translation: 用于冷却热源的冷却系统包括具有以多平面布置布置的多个嵌入式冷却通道的整体式结构，所述嵌入冷却通道构造成将冷却流体运送到整个整体结构的多个位置，冷却流体 被配置为吸收从与所述整体式结构相关联的热源传递的热量。 使用添加剂制造工艺，整体结构与嵌入式冷却通道一体形成。
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2.发明申请MONOLITHIC MULTI-MODULE ELECTRONICS CHASSIS WITH MULTI-PLANAR EMBEDDED FLUID COOLING CHANNELS 有权具有多平面嵌入式流体冷却通道的单模多模电子机箱公开(公告)号：US20150305198A1
公开(公告)日：2015-10-22
申请号：US14254518
申请日：2014-04-16
Applicant: Raytheon Company
Inventor： David B. Brandt , Robert K. Dodds , David W. Chu , Alicia G. Allen , Gregory P. Schaefer
CPC classification number: H05K7/20218 , H05K7/20254 , H05K7/20636 , H05K13/00
Abstract: A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.
Abstract translation: 用于冷却热源的冷却系统包括具有以多平面布置布置的多个嵌入式冷却通道的整体式结构，所述嵌入冷却通道构造成将冷却流体运送到整个整体结构的多个位置，冷却流体 被配置为吸收从与所述整体式结构相关联的热源传递的热量。 使用添加剂制造工艺，整体结构与嵌入式冷却通道一体形成。
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