公开(公告)号：US10443958B2

公开(公告)日：2019-10-15

申请号：US15137370

申请日：2016-04-25

Applicant: Raytheon Company

Inventor： Michael L. Andersen ,  Travis L. Mayberry ,  Gregory P. Schaefer

IPC: B23K1/06 ,  F28F9/02 ,  B23K20/10 ,  B23K20/22 ,  B23K20/233 ,  F28F7/02 ,  B33Y10/00 ,  B33Y80/00 ,  B23K101/14 ,  B23K103/10 ,  B23K103/08

Abstract: A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.

公开(公告)号：US09468131B2

公开(公告)日：2016-10-11

申请号：US14254518

申请日：2014-04-16

Applicant: Raytheon Company

Inventor： David B. Brandt ,  Robert K. Dodds ,  David W. Chu ,  Alicia G. Allen ,  Gregory P. Schaefer

IPC: H05K7/20 ,  H05K13/00

CPC classification number: H05K7/20218 ,  H05K7/20254 ,  H05K7/20636 ,  H05K13/00

Abstract: A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.

Abstract translation: 用于冷却热源的冷却系统包括具有以多平面布置布置的多个嵌入式冷却通道的整体式结构，所述嵌入冷却通道构造成将冷却流体运送到整个整体结构的多个位置，冷却流体 被配置为吸收从与所述整体式结构相关联的热源传递的热量。 使用添加剂制造工艺，整体结构与嵌入式冷却通道一体形成。

公开(公告)号：US11558957B2

公开(公告)日：2023-01-17

申请号：US16900390

申请日：2020-06-12

Applicant: Raytheon Company ,  THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY

Inventor： David H. Altman ,  Christopher H. Peters ,  Gregory P. Schaefer ,  Philip M. Henault ,  Darin J. Sharar

IPC: H05K1/02 ,  H05K3/00

Abstract: An electronic assembly including a thermal capacitor. An electronic substrate of the electronic assembly includes one or more insulating layers and one or more conductor layers provided along the one or more insulating layers. The one or more conductor layers including a conductive material. A shape memory thermal capacitor is received in the electronic substrate. The shape memory thermal capacitor includes a shape memory core including a shape memory material.

公开(公告)号：US20170304964A1

公开(公告)日：2017-10-26

申请号：US15137370

申请日：2016-04-25

Applicant: Raytheon Company

Inventor： Michael L. Andersen ,  Travis L. Mayberry ,  Gregory P. Schaefer

IPC: B23K37/00 ,  B23K20/10 ,  F28F9/02 ,  B23K101/14 ,  B33Y10/00 ,  B23K103/10 ,  B33Y80/00

CPC classification number: F28F9/02 ,  B23K20/10 ,  B23K20/103 ,  B23K20/22 ,  B23K20/2336 ,  B23K2101/14 ,  B23K2103/08 ,  B23K2103/10 ,  B33Y10/00 ,  B33Y80/00 ,  F28F7/02 ,  F28F2250/106

Abstract: A manifold structure and method of forming a structure having at least one enclosed cavity includes using an ultrasonic additive manufacturing (UAM) process to build up a solid component, forming a cavity in the solid component, filling the cavity with a sacrificial material, using a UAM process to build up a finstock layer over the cavity filled with the powder material to enclose the cavity and form the enclosed cavity, and removing the sacrificial material from the enclosed cavity after the finstock layer is ultrasonically welded to the solid component. The sacrificial material has an adequate density to support the UAM process of forming the finstock layer over the cavity and the material may be removed from the enclosed cavity, resulting in an enclosed cavity having smooth surfaces with an optimal fluid flow area therethrough.

公开(公告)号：US20150305198A1

公开(公告)日：2015-10-22

申请号：US14254518

申请日：2014-04-16

Applicant: Raytheon Company

Inventor： David B. Brandt ,  Robert K. Dodds ,  David W. Chu ,  Alicia G. Allen ,  Gregory P. Schaefer

IPC: H05K7/20 ,  H05K13/00

CPC classification number: H05K7/20218 ,  H05K7/20254 ,  H05K7/20636 ,  H05K13/00

Abstract: A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process.

Abstract translation: 用于冷却热源的冷却系统包括具有以多平面布置布置的多个嵌入式冷却通道的整体式结构，所述嵌入冷却通道构造成将冷却流体运送到整个整体结构的多个位置，冷却流体 被配置为吸收从与所述整体式结构相关联的热源传递的热量。 使用添加剂制造工艺，整体结构与嵌入式冷却通道一体形成。