公开(公告)号：US10716232B2

公开(公告)日：2020-07-14

申请号：US16109519

申请日：2018-08-22

Applicant: Raytheon Company

Inventor： Derek B. Wells ,  Kenneth P. Walsh, Jr. ,  Gregory S. Renaud ,  Dimitry Zarkh

IPC: H05K7/14 ,  H05K1/18 ,  H05K3/32

Abstract: A mounting collar comprises a collar body comprising an opening for receiving at least a portion of an electronics component (e.g., capacitor) of an electronics assembly, and a radial retention component supported about an inner surface (e.g., annular groove) of the opening of the collar body. The radial retention component (e.g., elastomeric O-ring) is operable to apply a radial force on the electronics component to at least partially support the electronics component. A mounting system comprises a first mounting collar for mounting a first electronics component to a support structure, and a second mounting collar for mounting a second electronics component to the support structure. The first and second mounting collars can be nested together to minimize a distance between the first and second electronics components. The first and second mounting collars can each comprise an elastomeric O-ring to reduce strain between the electronics components and the circuit board. Associated systems and methods are provided.

公开(公告)号：US12222438B1

公开(公告)日：2025-02-11

申请号：US18485029

申请日：2023-10-11

Applicant: Raytheon Company

Inventor： Derek P. Rocca ,  Michael T. Borkowski ,  Thomas Lulsdorf ,  Kenneth P. Walsh, Jr. ,  Christopher J. Yafrate ,  Michael P. Martinez ,  Erin K. Nolan ,  Kassam K. Bellahrossi ,  Bryan J. Cavener

IPC: G01S7/03 ,  H05K7/20 ,  G01S7/02

Abstract: A system and apparatus is provided for a modular radar system. The modular radar system can include a plurality of radar system modules that can be detachably coupled and can include a configurable number of radio-frequency (RF) transmit and receive assemblies. The RF transmit and receive assemblies can include radiating element(s) that emit electromagnetic radiation. The plurality of radar system modules can also include at least one processor coupled to control power of the electromagnetic radiation and/or at least one controller to control the RF transmit and receive assembly, the power unit and the digital receiver and exciter module, at least one digital receiver and exciter to convert RF to digital in receive mode, and digital to RF in transmit mode, and/or at least one RF beamformer to generate one or more RF beams.

公开(公告)号：US11808879B1

公开(公告)日：2023-11-07

申请号：US16710233

申请日：2019-12-11

Applicant: Raytheon Company

Inventor： Derek P. Rocca ,  Michael T. Borkowski ,  Thomas Lulsdorf ,  Kenneth P. Walsh, Jr. ,  Christopher J. Yafrate ,  Michael P. Martinez ,  Erin K. Nolan ,  Kassam K. Bellahrossi ,  Bryan J. Cavener

IPC: G01S7/03 ,  G01S7/20 ,  G01S7/02 ,  H05K7/20

CPC classification number: G01S7/032 ,  H05K7/20254 ,  H05K7/20272 ,  G01S7/027

Abstract: A system and apparatus is provided for a modular radar system. The modular radar system can include a plurality of radar system modules that can be detachably coupled and can include a configurable number of radio-frequency (RF) transmit and receive assemblies. The RF transmit and receive assemblies can include radiating element(s) that emit electromagnetic radiation. The plurality of radar system modules can also include at least one processor coupled to control power of the electromagnetic radiation and/or at least one controller to control the RF transmit and receive assembly, the power unit and the digital receiver and exciter module, at least one digital receiver and exciter to convert RF to digital in receive mode, and digital to RF in transmit mode, and/or at least one RF beamformer to generate one or more RF beams.

公开(公告)号：US10939582B2

公开(公告)日：2021-03-02

申请号：US16824910

申请日：2020-03-20

Applicant: Raytheon Company

Inventor： Dennis W. Mercier ,  Kenneth P. Walsh, Jr. ,  Gregory S. Renaud ,  Derek B. Wells

IPC: H05K7/20 ,  F16B37/12 ,  H05K7/14 ,  H01R12/70 ,  H01R43/26 ,  H05K1/18 ,  H05K3/30 ,  G01S7/03 ,  G01S7/02

Abstract: An apparatus is disclosed comprising: a chassis including an array plate, the array plate having a plurality of first openings formed thereon; a plurality of floating inserts, each of the floating inserts being disposed in a different one of the first openings; a main board having a plurality of second openings formed thereon, the main board being coupled to the array plate via a plurality of alignment pins, each of the alignment pins extending through a respective one of the plurality of floating inserts and into a respective one of the plurality of second openings; and an electronic module coupled to the main board, the electronic module including a first connector and at least one alignment socket, the first connector being coupled to a second connector that is disposed on the main board, the alignment socket being arranged to receive a given one of the alignment pins.