公开(公告)号：US20160055971A1

公开(公告)日：2016-02-25

申请号：US14467299

申请日：2014-08-25

Applicant: Raytheon Company

Inventor： Anurag Gupta ,  Robert R. Lopez ,  Stephen B. Kuznetsov

IPC: H01G2/08 ,  H01G4/38

CPC classification number: H01G2/08 ,  H01G2/106 ,  H01G4/38

Abstract: A high density capacitor comprises a housing having a cavity, and a plurality of capacitors forming at least one capacitor bank disposed in the housing cavity. A native cooling fluid is disposed in the cavity, and a heat exchanger is coupled to the housing. A pump is configured to circulate the native cooling fluid from the cavity, through the heat exchanger, through the spacings along an outer surface of each of the capacitors to cool the capacitors using forced convection. The heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger. The heat exchanger may have a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank.

Abstract translation: 高密度电容器包括具有空腔的壳体和形成设置在壳体腔中的至少一个电容器组的多个电容器。 天然冷却流体设置在空腔中，并且热交换器联接到壳体。 泵被构造成使空气中的天然冷却流体通过热交换器通过沿着每个电容器的外表面的间隔循环，以使用强制对流来冷却电容器。 热交换器构造成使二次流体通过热交换器并从流过热交换器的天然冷却流体抽取热量。 热交换器可以具有多个开口，该多个开口被配置为从靠近该至少一个电容器组的热交换器分配天然冷却流体。

公开(公告)号：US09911532B2

公开(公告)日：2018-03-06

申请号：US14467299

申请日：2014-08-25

Applicant: Raytheon Company

Inventor： Anurag Gupta ,  Robert R. Lopez ,  Stephen B. Kuznetsov

IPC: H01G2/14 ,  H01G5/017 ,  H01G4/002 ,  H01G2/08 ,  H05K7/20 ,  H01G2/10 ,  H01G4/38

CPC classification number: H01G2/08 ,  H01G2/106 ,  H01G4/38

Abstract: A high density capacitor comprises a housing having a cavity, and a plurality of capacitors forming at least one capacitor bank disposed in the housing cavity. A native cooling fluid is disposed in the cavity, and a heat exchanger is coupled to the housing. A pump is configured to circulate the native cooling fluid from the cavity, through the heat exchanger, through the spacings along an outer surface of each of the capacitors to cool the capacitors using forced convection. The heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger. The heat exchanger may have a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank.