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    POWER ELECTRONIC ASSEMBLY WITH A HOUSING AND WITH A CAPACITOR DEVICE ARRANGED THEREIN
    1.
    发明公开
    POWER ELECTRONIC ASSEMBLY WITH A HOUSING AND WITH A CAPACITOR DEVICE ARRANGED THEREIN 审中-公开

    公开(公告)号：US20240194412A1

    公开(公告)日：2024-06-13

    申请号：US18239365

    申请日：2023-08-29

    Applicant: SEMIKRON ELEKTRONIK GMBH & CO.KG

    Inventor： Johannes KLIER

    IPC: H01G4/38 ,  H01G2/10 ,  H05K7/14 ,  H05K7/20

    CPC classification number: H01G4/38 ,  H01G2/106 ,  H05K7/14329 ,  H05K7/2089

    Abstract: A power electronic assembly with a housing and a capacitor device therein. The capacitor device has capacitor elements, each with a first and a second capacitor contact device, and a capacitor busbar having a first metal shaped body with a first contact point and a second metal shaped body with a second contact point. The first metal shaped body of first polarity has a plurality of first terminal contact devices each connected to a first capacitor contact device and the second metal shaped body of second polarity has a plurality of second terminal contact devices each connected to a second capacitor contact device. The individual current paths each formed from a first partial current path between the first contact point and a first terminal contact device and a second partial current path between the second terminal contact device associated with the first and the second contact point each have the same current path length.

    Film capacitor for power electronics
    2.
    发明授权
    Film capacitor for power electronics 有权

    公开(公告)号：US11942274B2

    公开(公告)日：2024-03-26

    申请号：US17638791

    申请日：2020-08-19

    Applicant: Wolfgang Westermann

    Inventor： Axel Westermann

    IPC: H01G2/10 ,  H01G4/232 ,  H01G4/32 ,  H01G4/38

    CPC classification number: H01G2/106 ,  H01G4/232 ,  H01G4/32 ,  H01G4/38

    Abstract: The invention relates to a film capacitor for power electronics, which comprises a first electrically conductive layer, which is arranged on a first end side face of the film capacitor, wherein the surface normal of the first electrically conductive layer is perpendicular to the surface normals of dielectric films of the film capacitor. A second electrically conductive layer is arranged on a second end side face opposite from the first end side face, wherein the surface normal of the second electrically conductive layer is perpendicular to the surface normals of the dielectric films of the film capacitor. The film capacitor has at least one inner passage, which extends from the first electrically conductive layer to the second electrically conductive layer, wherein the passage is formed by removal of capacitor material. The invention also relates to a capacitor assembly.

    ELECTRICAL DEVICE
    3.
    发明公开
    ELECTRICAL DEVICE 审中-公开

    公开(公告)号：US20240098881A1

    公开(公告)日：2024-03-21

    申请号：US18275896

    申请日：2022-01-17

    Applicant: MEIDENSHA CORPORATION

    Inventor： Shota SUZUKI

    IPC: H05K1/02 ,  H01G2/08 ,  H01G2/10

    CPC classification number: H05K1/0215 ,  H01G2/08 ,  H01G2/106 ,  H05K2201/10409

    Abstract: An electrical device according to the present invention has a case (1), a metallic heat sink plate (4) disposed an opening portion (OP) of the case and a circuit board (5) arranged on the heat sink plate. The heat sink plate (4) is interposed between a capacitor (2) and the circuit board (5) so that the circuit board (5) is separated from the capacitor (2) by not only the resinous case (1) but also the metallic heat sink plate (4). Thus, electromagnetic space noise generated from the capacitor (2) is shielded or reduced by the metallic heat sink plate (4) whereby a malfunction of the circuit board (5) is prevented from occurring due to electromagnetic space noise generated from the capacitor (2).

    Film capacitor manufacturing method and case
    4.
    发明授权
    Film capacitor manufacturing method and case 有权

    公开(公告)号：US11682520B2

    公开(公告)日：2023-06-20

    申请号：US16759619

    申请日：2017-10-30

    Applicant: HITACHI CHEMICAL COMPANY, LTD.

    Inventor： Kasumi Nakamura ,  Tatsuhito Fukuhara ,  Yasunori Kawabata ,  Takahide Iwaya

    IPC: H01G2/10 ,  H01G4/224

    CPC classification number: H01G2/103 ,  H01G2/106 ,  H01G4/224

    Abstract: A method for producing a film capacitor, the method including a sealing material supplying step of supplying a curable sealing material 30a to an element accommodating space 20a in which a film capacitor element 10 having a rolled body 12 is accommodated; and a curing step of curing the sealing material 30a in a state in which the rolled body 12 is embedded in the sealing material 30a, in which at the time of initiating the sealing material supplying step, the rolled body 12 is not fixed by the sealing material 30a, and in the sealing material supplying step, the sealing material 30a is supplied to the element accommodating space 20a without curing the sealing material 30a, from the beginning of the supply of the sealing material 30a to the element accommodating space 20a until the rolled body 12 is embedded in the sealing material 30a.

    HIGH PRESSURE RESISTANT CAPACITOR ASSEMBLY AND ASSEMBLY METHOD
    6.
    发明申请
    HIGH PRESSURE RESISTANT CAPACITOR ASSEMBLY AND ASSEMBLY METHOD 有权

    公开(公告)号：US20170301463A1

    公开(公告)日：2017-10-19

    申请号：US15325556

    申请日：2015-07-29

    Applicant: Siemens Aktiengesellschaft

    Inventor： Ove BOE

    IPC: H01G2/10

    CPC classification number: H01G2/106 ,  H01G2/103 ,  H01G4/04 ,  H01G4/1272 ,  H01G4/14 ,  H01G4/224 ,  H01G4/38

    Abstract: A capacitor assembly and a method of assembling a capacitor assembly are provided. The capacitor assembly has at least two capacitor stacks, which have a layer structure including a top layer and a bottom layer. A support assembly supports the capacitor stacks. The capacitor stacks are stacked on top of each other in the support assembly. The support assembly has a compression member which compresses the at least two capacitor stacks in a direction substantially perpendicular to the layer structure. A pressure distribution arrangement adjusts the distribution of the pressure applied to the capacitor stacks by the compression member.

    Electronic device having capacitor
    8.
    发明授权
    Electronic device having capacitor 有权

    公开(公告)号：US09773613B2

    公开(公告)日：2017-09-26

    申请号：US15139867

    申请日：2016-04-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Joonsoo Lee ,  Myungjae Jo ,  Chulhyung Yang ,  Jiwoo Lee

    IPC: H01G4/005 ,  H01Q1/24 ,  H01G4/06

    CPC classification number: H01G4/005 ,  H01G2/106 ,  H01G4/06 ,  H01Q1/243 ,  H05K1/0215 ,  H05K1/0257 ,  H05K1/189

    Abstract: An electronic device is provided. The electronic device includes a housing, an antenna radiating body including a conductive metal, a first member disposed within the housing and electrically connected to the antenna radiating body, a printed circuit board (PCB) disposed within the housing, a flexible connecting member disposed between at least a portion of the first member and at least a portion of a second member and including a conductive material, and a capacitor including a first conductive plate that contacts the second member or formed by a portion of the second member, a second conductive plate, separated from the first conductive plate and electrically connected to the PCB, and a dielectric layer inserted between the first conductive plate and the second conductive plate.

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