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公开(公告)号：US10741901B2
公开(公告)日：2020-08-11
申请号：US15786474
申请日：2017-10-17
Applicant: Raytheon Company
Inventor： Yueh-Chi Chang , Brandon K.W. Mui , Stephen J. Pereira , Richard S. Young , Gregory M. Fagerlund , Wayne B. Mattis
Abstract: An apparatus includes a stacked patch radiator having (i) a lower patch and (ii) an upper patch located above and separated from the lower patch. The upper patch includes first and second conductive patches that are separated from one another. The apparatus also includes a heating circuit integrated in the stacked patch radiator. At least a portion of the heating circuit is positioned between the first and second conductive patches of the upper patch. The stacked patch radiator can be configured to radiate at a specified frequency band and can have a thickness that is less than one tenth of wavelengths within the specified frequency band. The upper patch can include conductive vias electrically connecting the conductive patches. The conductive patches and the conductive vias can form an isolation cage configured to reduce a signal loss associated with a presence of at least the portion of the heating circuit between the conductive patches.
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公开(公告)号：US20190115645A1
公开(公告)日：2019-04-18
申请号：US15786474
申请日：2017-10-17
Applicant: Raytheon Company
Inventor： Yueh-Chi Chang , Brandon K. W. Mui , Stephen J. Pereira , Richard S. Young , Gregory M. Fagerlund , Wayne B. Mattis
CPC classification number: H01Q1/02 , H01Q1/38 , H01Q1/523 , H01Q3/38 , H01Q9/0414 , H01Q9/0457 , H01Q21/0075 , H01Q21/065
Abstract: An apparatus includes a stacked patch radiator having (i) a lower patch and (ii) an upper patch located above and separated from the lower patch. The upper patch includes first and second conductive patches that are separated from one another. The apparatus also includes a heating circuit integrated in the stacked patch radiator. At least a portion of the heating circuit is positioned between the first and second conductive patches of the upper patch. The stacked patch radiator can be configured to radiate at a specified frequency band and can have a thickness that is less than one tenth of wavelengths within the specified frequency band. The upper patch can include conductive vias electrically connecting the conductive patches. The conductive patches and the conductive vias can form an isolation cage configured to reduce a signal loss associated with a presence of at least the portion of the heating circuit between the conductive patches.
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