Embedded mask patterning process for fabricating magnetic media and other structures

    公开(公告)号:US09721767B2

    公开(公告)日:2017-08-01

    申请号:US14422262

    申请日:2013-08-21

    CPC classification number: H01J37/32899 C23C16/44 G11B5/855

    Abstract: In some examples, a method comprising depositing a functional layer (e.g., a magnetic layer) over a substrate; depositing a granular layer over the functional layer, the granular layer including a first material defining a plurality of grains separated by a second material defining grain boundaries of the plurality of grains; removing the second material from the granular layer such that the plurality of grains of the granular layer define a hard mask layer on the functional layer; and removing portions of the functional layer not masked by the hard mask layer, wherein the depositing of the functional layer, the depositing of the granular layer, removing the second material, and removing the portions of the functional layer are performed in a vacuum environment.

    EMBEDDED MASK PATTERNING PROCESS FOR FABRICATING MAGNETIC MEDIA AND OTHER STRUCTURES
    2.
    发明申请
    EMBEDDED MASK PATTERNING PROCESS FOR FABRICATING MAGNETIC MEDIA AND OTHER STRUCTURES 有权
    用于制作磁性介质和其他结构的嵌入式掩模图案

    公开(公告)号:US20150221483A1

    公开(公告)日:2015-08-06

    申请号:US14422262

    申请日:2013-08-21

    CPC classification number: H01J37/32899 C23C16/44 G11B5/855

    Abstract: In some examples, a method comprising depositing a functional layer (e.g., a magnetic layer) over a substrate; depositing a granular layer over the functional layer, the granular layer including a first material defining a plurality of grains separated by a second material defining grain boundaries of the plurality of grains; removing the second material from the granular layer such that the plurality of grains of the granular layer define a hard mask layer on the functional layer; and removing portions of the functional layer not masked by the hard mask layer, wherein the depositing of the functional layer, the depositing of the granular layer, removing the second material, and removing the portions of the functional layer are performed in a vacuum environment.

    Abstract translation: 在一些实例中,包括在衬底上沉积功能层(例如,磁性层)的方法; 在所述功能层上沉积颗粒层,所述颗粒层包括限定由限定所述多个颗粒的晶界的第二材料分开的多个晶粒的第一材料; 从所述颗粒层中去除所述第二材料,使得所述颗粒层的所述多个颗粒在所述功能层上限定硬掩模层; 并且去除未被硬掩模层掩蔽的功能层的部分,其中功能层的沉积,颗粒层的沉积,去除第二材料以及去除功能层的部分在真空环境中进行。

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