公开(公告)号：US20240279478A1

公开(公告)日：2024-08-22

申请号：US18566877

申请日：2022-07-07

申请人： Resonac Corporation

发明人： Hiroki KUZUOKA ,  Tomohiko KOTAKE

IPC分类号： C08L101/12 ,  C08J5/18 ,  C08K3/013

CPC分类号： C08L101/12 ,  C08J5/18 ,  C08K3/013 ,  C08J2399/00 ,  C08K2201/001 ,  C08L2203/206 ,  C08L2205/02

摘要： Provided are a resin composition containing (A) a thermosetting resin. (B) a compound that is in a liquid state at 25° C. has a reactive group, and has a molecular weight of 1,000 or less, and (C) an inorganic filler, a resin film using the resin composition, a printed wiring board, and a semiconductor package.