公开(公告)号：US08179679B2

公开(公告)日：2012-05-15

申请号：US11412380

申请日：2006-04-27

Applicant: Richard A. Slagle

Inventor： Richard A. Slagle

IPC: H05K7/20

CPC classification number: H05K1/0272 ,  G06F1/20 ,  H05K1/0203 ,  H05K2201/09045 ,  H05K2201/09909

Abstract: An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the board and around components mounted to the board. The wall may be utilized for controlling airflow in combination with a second printed circuit board positioned adjacent to the first printed circuit board. The wall may be utilized for controlling various types of airflow, including airflow from sources including fans and convection, and from geometries including horizontal and vertical mounting geometries. The silicon wall may be utilized for preventing heat airflow generated by heat radiated from one component from impinging upon another component.

Abstract translation: 电子设备包括印刷电路板，其具有直接沉积在用作印刷电路基底的板上的壁。 当板被构造时，壁被沉积在板上用于控制气流。 墙壁控制板上的气流和安装在板上的组件。 该壁可用于与邻近第一印刷电路板定位的第二印刷电路板组合地控制气流。 该壁可用于控制各种类型的气流，包括来自包括风扇和对流的源的气流以及包括水平和垂直安装几何形状的几何形状。 硅壁可用于防止由一个部件辐射的热量产生的热气流撞击另一个部件。