公开(公告)号：US11917763B2

公开(公告)日：2024-02-27

申请号：US17024154

申请日：2020-09-17

Applicant: SHENZHEN GOODIX TECHNOLOGY CO., LTD.

Inventor： Fanzhou Zeng ,  Xiangying Liu

IPC: G06K9/00 ,  H05K1/18 ,  H05K1/02 ,  G06V40/13

CPC classification number: H05K1/189 ,  G06V40/1318 ,  H05K1/0284 ,  H05K1/181 ,  H05K2201/09045 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A fingerprint identification apparatus and an electrode device. The fingerprint identification apparatus could be configured to be disposed under a variety of different display screens, reducing a thickness of space for installation of the fingerprint identification apparatus under a screen. The fingerprint identification apparatus includes: a support plate; and at least one fingerprint sensor chip, the at least one fingerprint sensor chip being disposed at an upper surface of the support plate; where the support plate is configured to be mounted to an upper surface of a middle frame of the electronic device so that the at least one fingerprint sensor chip is located under the display screen of the electronic device; and the at least one fingerprint sensor chip is configured to receive a fingerprint detecting signal returned by reflection or scattering via a human finger on the display screen.

公开(公告)号：US20190140551A1

公开(公告)日：2019-05-09

申请号：US16024793

申请日：2018-06-30

Applicant: Delta Electronics (Thailand) Public Company Limited

Inventor： Hao LU ,  Tianding Hong ,  Bofeng Xu ,  Jie Ruan ,  Jinfa Zhang

IPC: H02M7/00 ,  H05K1/14 ,  H05K1/02

CPC classification number: H02M7/003 ,  H02M2001/0048 ,  H05K1/0242 ,  H05K1/0263 ,  H05K1/141 ,  H05K2201/09045 ,  H05K2201/09909 ,  H05K2201/1003 ,  H05K2201/10272

Abstract: A rectification module includes a transformer, a connecting unit and a rectification unit. The transformer includes a first lateral region, a second lateral region and at least one secondary winding assembly. The second lateral region is located beside the first lateral region. The secondary winding assembly includes plural outlet ends. The plural outlet ends are arranged near the first lateral region. The connecting unit is located at the first lateral region, and includes plural conducting parts. Each of the conducting parts includes at least one opening and at least one connecting structure. The conducting parts are partially or completely stacked on each other. The outlet ends are accommodated within the corresponding openings. The conducting parts are fixed on the first lateral region. The connecting structures face the second lateral region. The rectification unit includes a circuit board and plural rectifier components.

公开(公告)号：US20180317321A1

公开(公告)日：2018-11-01

申请号：US15904577

申请日：2018-02-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kenichi MORI ,  Kazuyuki KUBOTA ,  Yoshihiro IHARA

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H01R12/72

CPC classification number: H05K1/144 ,  H01R12/721 ,  H01R12/725 ,  H01R12/728 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09409 ,  H05K2201/10522

Abstract: A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.

公开(公告)号：US10008797B2

公开(公告)日：2018-06-26

申请号：US14796470

申请日：2015-07-10

Applicant: Tyco Electronics Corporation

Inventor： Mudhafar Hassan-Ali ,  Jason Larson

IPC: H05K1/11 ,  H01R12/79 ,  H05K1/02 ,  H05K3/36 ,  H05K1/00 ,  H01R12/71 ,  H05K1/14 ,  H01R12/59 ,  H05K3/32

CPC classification number: H01R12/79 ,  H01R12/59 ,  H01R12/71 ,  H01R12/712 ,  H01R12/718 ,  H05K1/0298 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/046 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/096

Abstract: Flexible printed circuit (FPC) connector includes a flex circuit having first and second side surfaces and a thickness extending between the first and second side surfaces. The flex circuit includes a plurality of stacked substrate layers. The FPC connector also includes a conductive pathway extending through the flex circuit and a substrate protrusion coupled to the second side surface and projecting a distance away from the second side surface. The substrate protrusion is formed from at least one dielectric layer. The FPC connector also includes a contact pad that is directly coupled to at least one of the substrate protrusion or the second side surface of the flex circuit. The contact pad is electrically coupled to the conductive pathway.

公开(公告)号：US09942980B2

公开(公告)日：2018-04-10

申请号：US15123215

申请日：2014-05-28

Applicant: INTEL CORPORATION

Inventor： Chuan Hu ,  Adel A. Elsherbini ,  Yoshihiro Tomita ,  Shawna Liff

IPC: H01L23/538 ,  H05K1/02 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H05K1/18

CPC classification number: H05K1/0283 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/1515 ,  H01L2924/181 ,  H05K1/036 ,  H05K1/185 ,  H05K3/1275 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09263 ,  H05K2201/10151 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.

公开(公告)号：US09914065B2

公开(公告)日：2018-03-13

申请号：US14917564

申请日：2014-09-03

Applicant: BRIXO SMART TOYS LTD.

Inventor： Boaz Almog ,  Amir Saraf

IPC: A63H33/04 ,  A63H33/08 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32

CPC classification number: A63H33/042 ,  A63H33/086 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/326 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0999 ,  H05K2201/209

Abstract: The present invention relates to a selectively conductive toy building element, comprising: a body adapted for releasable engagement to at least one other toy building element body or to a corresponding baseplate, the body including at least one conductive portion having at least one contact area adapted to generate pressure on a conductive portion or contact area of an adjacent toy building element body, in such a way that ensures electrical conduction between said toy building elements in a desired location and direction.

公开(公告)号：US09910552B2

公开(公告)日：2018-03-06

申请号：US15508882

申请日：2016-02-01

Applicant: FUJIKURA LTD.

Inventor： Takeshi Shiojiri ,  Takaharu Hondo

IPC: G06F3/044 ,  H05K1/03 ,  H05K3/10 ,  H05K3/28

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0313 ,  H05K3/10 ,  H05K3/28 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2201/10151

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1−H2|

公开(公告)号：US20180063953A1

公开(公告)日：2018-03-01

申请号：US15677395

申请日：2017-08-15

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jung Yun JO ,  Jeong Do YANG

IPC: H05K1/11 ,  H05K3/18 ,  H05K3/28 ,  H05K3/40

CPC classification number: H05K1/111 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/188 ,  H05K3/28 ,  H05K3/36 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/0939 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2203/0723

Abstract: A circuit board, a display device including the same, and a method of manufacturing a circuit board are provided. A circuit board includes a base substrate, a wiring line provided on the base substrate, a passivation layer provided on the wiring line, an elastic bump provided on the passivation layer, and a conductive layer provided on the elastic bump. The passivation layer includes a first opening and a second opening that expose a partial region of the wiring line, and the second opening is arranged in a region adjacent to the first opening.

公开(公告)号：US20170243890A1

公开(公告)日：2017-08-24

申请号：US15432194

申请日：2017-02-14

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： HEESOON JEONG

IPC: H01L27/12 ,  H05K1/11 ,  H05K1/18 ,  H01L23/00

CPC classification number: H01L27/124 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/09 ,  H01L2224/05026 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/06102 ,  H01L2224/06135 ,  H01L2224/06177 ,  H01L2224/06181 ,  H01L2224/08238 ,  H01L2224/09181 ,  H05K1/117 ,  H05K1/14 ,  H05K1/183 ,  H05K3/325 ,  H05K3/36 ,  H05K2201/09045 ,  H05K2201/094 ,  H05K2201/10128 ,  H05K2203/167

Abstract: A display apparatus includes a display panel configured to display an image and including a first pad part, the first pad part including a plurality of first pads disposed at a first edge thereof, and a printed circuit board having an insertion hole in which at least a portion of the first edge of the first pad part is accommodated. The printed circuit board includes a plurality of first terminals disposed on an inner surface of the insertion hole to contact the plurality of first pads.

公开(公告)号：US20170136945A1

公开(公告)日：2017-05-18

申请号：US15417453

申请日：2017-01-27

Applicant: YAZAKI CORPORATION

Inventor： Kazuhiro SHOHHARA

IPC: B60Q3/20 ,  F21V23/06 ,  H01L33/62 ,  F21V14/02

CPC classification number: B60Q3/20 ,  F21V14/02 ,  F21V15/012 ,  F21V19/00 ,  F21V19/0015 ,  F21V23/06 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L33/62 ,  H02G5/005 ,  H05K1/183 ,  H05K2201/09045 ,  H05K2201/09072 ,  H05K2201/0999 ,  H05K2201/10106 ,  H05K2201/10272

Abstract: An illumination device includes a light emitting element, a bus bar in which the light emitting element is attached, and a housing in which the bus bar is insert-molded. The bus bar includes a bus bar main body which is flat-plate-shaped and a bent piece extended in the bus bar main body and bent so as to be inclined to the bus bar main body. The housing includes a protruding part which protrudes from a surface covering the bus bar main body so as to cover at least a part of the bent piece and which has an inclined surface parallel to the bent piece, and a hole on the inclined surface of the protruding part formed so that the bent piece is exposed. The light emitting element is attached to the bent piece so as to be accommodated in the hole.