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公开(公告)号：US12127329B2
公开(公告)日：2024-10-22
申请号：US17612010
申请日：2020-05-29
Applicant: HELLA GMBH & CO KGAA , INFINITE FLEX GMBH
Inventor： Dirk Bösch , Kangkai Ma
CPC classification number: H05K1/0204 , H05K1/118 , H05K3/0061 , H01L33/64 , H01L33/647 , H05K1/0207 , H05K1/189 , H05K7/205 , H05K2201/0187 , H05K2201/0195 , H05K2201/066 , H05K2201/099 , H05K2201/09909 , H05K2201/10106 , H05K2203/0522
Abstract: A flexible circuit board includes an electrically insulating cover layer, at least one electrical component arranged on the upper side of the cover layer with electrical contacts, a conducting track structure arranged on the underside of the cover layer and with contact regions, wherein the electrical contacts are each electrically conductively connected to one of the contact regions through one of a plurality of openings in the cover layer, a heat sink which is thermally conductively connected to each electrical component through the cover layer, and a layer with high conductivity. To create an improved cooling capacity of the electrical component, the heat arising in the electrical components is first dissipated effectively within the conducting paths of the conducting path structure and then dissipated out of the conducting paths directly into the heat sink by the layer with high heat conductivity.
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2.发明公开公开(公告)号：US20240292514A1
公开(公告)日：2024-08-29
申请号：US18572369
申请日：2022-06-30
Applicant: Lisa Dräxlmaier GmbH
Inventor： Andreas Brinkmann
IPC: H05K1/02 , B23K1/00 , B23K101/42 , H05K1/18 , H05K3/34
CPC classification number: H05K1/0204 , B23K1/0016 , H05K1/0209 , H05K3/3421 , H05K3/3452 , H05K3/3485 , B23K2101/42 , H05K1/181 , H05K2201/0305 , H05K2201/0989 , H05K2201/09909 , H05K2201/10689 , H05K2203/0557 , H05K2203/1178
Abstract: The present disclosure relates to a method for the process-reliable soldering of a chip package onto a printed circuit board for the process-reliable soldering of a chip package. The printed circuit board has a metallic cooling surface, a plurality of metallic contact surfaces surrounding the cooling surface, and, on a side opposite the cooling surface, a rear metallic mating surface, the mating surface being connected to the cooling surface by open vias, and lanes of solder resist being arranged on the cooling surface, which lanes both divide the cooling surface into a plurality of partial surfaces and enclose the vias.
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公开(公告)号：US12058885B2
公开(公告)日：2024-08-06
申请号：US17473824
申请日：2021-09-13
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Taekyung Yim
IPC: H10K50/84 , H10K50/844 , H10K50/86 , H10K59/12 , H10K59/40 , H10K59/65 , G02F1/1333 , G06F3/041 , H10K50/80 , H10K50/842 , H10K59/38
CPC classification number: H10K50/86 , H10K50/844 , H10K50/865 , H10K59/12 , H10K59/40 , H10K59/65 , G02F1/133331 , G06F3/0412 , H05K2201/09909 , H10K50/8426 , H10K50/868 , H10K59/38
Abstract: A display device includes a display panel that includes a first area and a second area that surrounds at least a portion of the first area. The display panel includes a base layer, a display element layer disposed on the base layer in the second area, an encapsulation layer disposed on the display element layer and that includes an opening portion that corresponds to the first area and an inclined portion that has a height that decreases with decreasing distance from the opening portion, and an inclination compensation layer that is disposed on the inclined portion and does not overlap the opening portion.
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公开(公告)号：US12016195B2
公开(公告)日：2024-06-18
申请号：US17483629
申请日：2021-09-23
Applicant: Samsung Display Co., Ltd.
Inventor： Hye Min Lee , Hyoung Sub Lee , Jin Ho Hyun , Woo Yong Sung
IPC: H10K50/84 , H10K50/844 , H10K59/12 , H10K59/121 , G02F1/1333 , G06F1/16 , G09F9/30 , H10K50/15 , H10K50/16 , H10K50/17 , H10K59/38 , H10K59/40 , H10K102/00
CPC classification number: H10K50/844 , H10K59/121 , G02F1/133331 , G06F1/1652 , G09F9/301 , G09G2380/02 , H05K2201/09909 , H10K50/15 , H10K50/16 , H10K50/17 , H10K50/171 , H10K59/38 , H10K59/40 , H10K2102/311
Abstract: A display device includes: a display panel having a front portion, a first bending portion, a second bending portion, and a corner portion, the display panel including a plurality of first pixels disposed in the front portion and a plurality of second pixels disposed in the corner portion. The display panel includes: a substrate; a first dam surrounding the plurality of first pixels; and a second dam surrounding the plurality of second pixels. The substrate includes a plurality of cutout patterns disposed in the corner portion, the plurality of second pixels and the second dam are disposed in each of the plurality of cutout patterns, and a height of an upper surface of the first dam is higher than a height of an upper surface of the second dam, based on one surface of the substrate.
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公开(公告)号：US20190053370A1
公开(公告)日：2019-02-14
申请号：US15872009
申请日：2018-01-16
Applicant: International Business Machines Corporation
Inventor： Sayuri Hada , Hiroyuki Mori , Keishi Okamoto
CPC classification number: H05K1/0271 , G01B21/08 , G01B21/20 , H05K1/0298 , H05K1/0313 , H05K3/0011 , H05K3/225 , H05K3/4644 , H05K2201/09136 , H05K2201/09909 , H05K2203/013 , H05K2203/163
Abstract: An organic substrate includes a core layer including organic materials; a first buildup layer on a top surface of the core layer; a second buildup layer on a bottom surface of the core layer; and at least one correction layer formed on at least one part of surfaces of the first buildup layer and the second buildup layer, wherein the correction layer has a thickness which has been calculated using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers for reducing warpage of the organic substrate.
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Patent Agency Ranking
公开(公告)号：US20180207673A1
公开(公告)日：2018-07-26
申请号：US15869645
申请日：2018-01-12
Applicant: ALPS ELECTRIC CO., LTD.
Inventor： Younggil CHOI , Boseok SEOK
CPC classification number: B05C11/02 , B05C5/0212 , H05K3/0091 , H05K3/284 , H05K2201/09909 , H05K2201/10977 , H05K2203/0759
Abstract: Disclosed herein is a printed circuit board having a structure for preventing coating liquid overflow. In the printed circuit board on which an electronic component is mounted and in which a connection hole for joining the electronic component and another component to each other is formed, a land region to which lead may be applied is formed adjacent to the connection hole.
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公开(公告)号：US20180145397A1
公开(公告)日：2018-05-24
申请号：US15863269
申请日：2018-01-05
Applicant: Alps Electric Co., Ltd.
Inventor： Masashi Nakagawa , Takehiro Seike , Hideki Watanabe , Yoshihisa Shibuya , Shunji Kuwana
CPC classification number: H01Q1/2283 , H01Q1/2291 , H01Q1/36 , H01Q1/405 , H01Q5/371 , H01Q9/42 , H05K1/0243 , H05K1/144 , H05K1/181 , H05K1/185 , H05K3/321 , H05K3/368 , H05K2201/042 , H05K2201/09909 , H05K2201/10098 , H05K2201/10522 , H05K2201/10568 , H05K2201/10636 , H05K2201/2036 , H05K2201/2081
Abstract: A high-frequency module includes a wiring substrate and an antenna substrate disposed on an upper surface of the wiring substrate, an antenna is formed by a metal pattern on the antenna substrate, a non-conductive adhesive and a conductive adhesive are disposed between the wiring substrate and the antenna substrate, and a spacer is provided between the non-conductive adhesive and the conductive adhesive. Thus, by the spacer, it is possible to prevent contact between the non-conductive adhesive and the conductive adhesive and it is also possible to ensure a required height between the wiring substrate and the antenna substrate. In addition, it is possible to achieve connection between the wiring substrate and the antenna substrate by a simple structure.
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8.发明授权公开(公告)号：US09974168B2
公开(公告)日：2018-05-15
申请号：US14861272
申请日：2015-09-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Sumiyo Nakamura , Takahiro Sumi , Takahiro Oka
IPC: H05K1/00 , H05K1/03 , C04B35/195 , H01L23/12 , H01L23/15 , H01L21/48 , H05K1/11 , H05K3/46 , C04B35/20 , H05K1/02 , H05K3/12 , H01L23/498
CPC classification number: H05K1/0306 , C04B35/195 , C04B35/20 , C04B35/62218 , C04B35/62625 , C04B2235/3215 , C04B2235/3217 , C04B2235/3481 , C04B2235/36 , C04B2235/80 , H01L21/4867 , H01L23/12 , H01L23/15 , H01L23/49822 , H01L23/49838 , H01L2924/0002 , H05K1/0298 , H05K1/111 , H05K1/115 , H05K3/1291 , H05K3/4629 , H05K2201/017 , H05K2201/0209 , H05K2201/068 , H05K2201/09563 , H05K2201/099 , H05K2201/09909 , Y02P70/611 , H01L2924/00
Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.
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公开(公告)号：US09967971B2
公开(公告)日：2018-05-08
申请号：US14938917
申请日：2015-11-12
Applicant: International Business Machines Corporation
Inventor： Sayuri Hada , Hiroyuki Mori , Keishi Okamoto
CPC classification number: H05K1/0271 , G01B21/08 , G01B21/20 , H05K1/0298 , H05K1/0313 , H05K3/0011 , H05K3/225 , H05K3/4644 , H05K2201/09136 , H05K2201/09909 , H05K2203/013 , H05K2203/163
Abstract: A method for reducing warpage on an organic substrate. The method includes: preparing an organic substrate, which includes (i) a core layer having an organic material, (ii) a first buildup layer on a front surface of the core layer, and (iii) a second buildup layer on a back surface of the core layer, measuring warpage of the organic substrate, calculating a thickness of a correction layer for reducing the warpage using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers, and forming at least one correction layer having the thickness on at least one part of surfaces of the first buildup layer and the second buildup layer. A system and an organic substrate is also provided.
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公开(公告)号：US09910213B2
公开(公告)日：2018-03-06
申请号：US15472851
申请日：2017-03-29
Applicant: Funai Electric Co., Ltd.
Inventor： Akira Yokawa , Yuki Kita , Akihiro Fujikawa , Yasuyuki Fukumoto , Yasuhiro Mori , Yuto Suzuki , Hirofumi Horiuchi , Hirohiko Tsuji , Takahito Yamanaka , Hideo Yonezawa
IPC: F21V8/00
CPC classification number: G02B6/0088 , G02B6/0068 , G02B6/0073 , G02B6/0085 , G02F1/133615 , G02F2001/133314 , G02F2001/133317 , G02F2001/133328 , G02F2001/133628 , G06F1/20 , H05K1/0209 , H05K7/20963 , H05K2201/0162 , H05K2201/09909
Abstract: This display includes a light source portion, a first heat radiation member for radiating heat generated by the light source portion, a rear housing covering the first heat radiation member in a state in contact with the first heat radiation member, and a cover member covering a rear surface of the rear housing so that the rear surface of the rear housing is partially exposed outward. The first heat radiation member is arranged on a region corresponding to a region of the rear housing exposed outward from the cover member as viewed from the side of the rear surface.
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