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273 条记录 (耗时 0.04 秒)

    Bottle cap
    9.
    外观设计
    Bottle cap 有权

    公开(公告)号：USD1019259S1

    公开(公告)日：2024-03-26

    申请号：US29911297

    申请日：2023-08-31

    申请人： Jun Chen

    设计人： Jun Chen

    摘要： FIG. 1 is a top perspective view of a bottle cap, showing my new design;
    FIG. 2 is a bottom perspective view thereof;
    FIG. 3 is a front view thereof;
    FIG. 4 is a rear view thereof;
    FIG. 5 is a left side view thereof;
    FIG. 6 is a right side view thereof;
    FIG. 7 is a top view thereof; and,
    FIG. 8 is a bottom view thereof.
    The dashed broken lines depict portions of the bottle cap that form no part of the claim design.

    Making a memoristic array with an implanted hard mask
    10.
    发明授权
    Making a memoristic array with an implanted hard mask 有权

    公开(公告)号：US11569440B2

    公开(公告)日：2023-01-31

    申请号：US15412076

    申请日：2017-01-23

    申请人： Yimin Guo ,  Rongfu Xiao ,  Jun Chen

    发明人： Yimin Guo ,  Rongfu Xiao ,  Jun Chen

    IPC分类号： H01L43/12 ,  H01L27/24 ,  H01L45/00 ,  H01L27/22

    摘要： The invention disclosed a method to make an implanted hard mask with ultra-small dimensions for fabricating integrated nonvolatile random access memory. Instead of directly depositing hard mask material on top of the memory film stack element, we first make ultra-small VIA holes on a pattern transfer molding (PTM) layer using a reverse memory mask, then fill in the hard mask material into the VIA holes within the PTM material. Ultra-small hard mask pillars are formed after removing the PTM material. To improve the adhesion of the hard mask pillars with the underneath memory stack element, a hard mask sustaining element (HMSE) is added below PTM. Due to a better materials adhesion between HMSE and the hard mask, a stronger hard mask array can be formed.