公开(公告)号：US5449955A

公开(公告)日：1995-09-12

申请号：US221731

申请日：1994-04-01

申请人： Richard P. Debiec ,  Michael D. Evans ,  Warren J. Pendergast

发明人： Richard P. Debiec ,  Michael D. Evans ,  Warren J. Pendergast

IPC分类号： H01R12/32 ,  H01L21/60 ,  H01L23/498 ,  H01L25/16 ,  H01R12/04 ,  H05K1/09 ,  H05K1/14 ,  H05K3/24 ,  H05K3/38 ,  H01L23/48 ,  H01L29/46 ,  H01L29/54 ,  H01L29/62

CPC分类号： H05K3/3452 ,  H01L23/49866 ,  H01L25/16 ,  H05K3/244 ,  H05K3/388 ,  H01L2924/0002 ,  H05K2203/0315

摘要： A multilayer composite interconnection for use in circuits including thin film elements and electrical interconnections includes a copper barrier layer interposed between a nickel layer and a gold layer of the interconnection. The copper layer is in a thickness sufficient to bar or at least to restrict diffusion of nickel through the gold layer under processing and operating conditions. The interconnection multilayer composite interconnection includes in an ascending order, titanium, palladium or palladium-titanium alloy, copper, nickel, copper barrier and gold layers.

摘要翻译： 用于包括薄膜元件和电互连的电路的多层复合互连包括介于镍层和互连金层之间的铜阻挡层。 铜层的厚度足以阻止或至少在加工和操作条件下限制镍通过金层的扩散。 互连多层复合互连以升序方式包括钛，钯或钯 - 钛合金，铜，镍，铜屏障和金层。