公开(公告)号：US5264107A

公开(公告)日：1993-11-23

申请号：US809694

申请日：1991-12-17

申请人： Richard S. Bentson ,  Jerry J. Rubin ,  Frank Stepniak

发明人： Richard S. Bentson ,  Jerry J. Rubin ,  Frank Stepniak

IPC分类号： C23C18/52 ,  H01L21/288 ,  H01L21/768 ,  C23C28/00

CPC分类号： H01L21/288 ,  H01L21/76877 ,  H01L2924/0002 ,  Y10S205/916

摘要： A nickel plug (31) filling an aperture in an insulating layer (30), such as polyimide, separating two metallization levels of copper wires (28, 25) is formed by an electroless process in a plating bath (solution) containing ions of hypophosphite and of nickel. In preparation for this electroless process, the copper wires (28, 25) are first plated with a nickel layer (29) by a pseudo-electroless process-that is, a process in which the copper wires (28, 25) are located in contact with an underlying extended chromium layer (14) that is placed in electrical contact (including intimate physical contact) with an auxiliary metallic member (41) that contains nickel, while both the copper wires (28, 25), the chromium layer (14), and at least a portion of the external metallic layer (41) are immersed in a plating solution likewise containing ions of hypophosphite and of nickel.