公开(公告)号：US5264107A

公开(公告)日：1993-11-23

申请号：US809694

申请日：1991-12-17

申请人： Richard S. Bentson ,  Jerry J. Rubin ,  Frank Stepniak

发明人： Richard S. Bentson ,  Jerry J. Rubin ,  Frank Stepniak

IPC分类号： C23C18/52 ,  H01L21/288 ,  H01L21/768 ,  C23C28/00

CPC分类号： H01L21/288 ,  H01L21/76877 ,  H01L2924/0002 ,  Y10S205/916

摘要： A nickel plug (31) filling an aperture in an insulating layer (30), such as polyimide, separating two metallization levels of copper wires (28, 25) is formed by an electroless process in a plating bath (solution) containing ions of hypophosphite and of nickel. In preparation for this electroless process, the copper wires (28, 25) are first plated with a nickel layer (29) by a pseudo-electroless process-that is, a process in which the copper wires (28, 25) are located in contact with an underlying extended chromium layer (14) that is placed in electrical contact (including intimate physical contact) with an auxiliary metallic member (41) that contains nickel, while both the copper wires (28, 25), the chromium layer (14), and at least a portion of the external metallic layer (41) are immersed in a plating solution likewise containing ions of hypophosphite and of nickel.

公开(公告)号：US4946549A

公开(公告)日：1990-08-07

申请号：US428137

申请日：1989-10-27

申请人： Bonnie J. Bachman ,  Elizabeth A. Hofstatter ,  Joan M. Ritter ,  Jerry J. Rubin

发明人： Bonnie J. Bachman ,  Elizabeth A. Hofstatter ,  Joan M. Ritter ,  Jerry J. Rubin

IPC分类号： G03F7/42 ,  H05K3/28

CPC分类号： H05K3/288 ,  G03F7/427 ,  H05K2201/0179 ,  H05K2203/0769 ,  H05K2203/095 ,  H05K3/28

摘要： Disclosed is a method for removing poly-para-xylylene, its derivatives, and copolymers (collectively called "parylene") from bodies, including relatively large bodies such as printed circuit (PC) boards, that is capable of yielding relatively high removal rates. A body such as a PC board coated with parylene is placed into a reaction chamber downstream from a microwave plasma such that plasma discharge products generated by the microwave plasma react with the parylene, etching the parylene without exposing the body to bombardment by energetic ions and/or electrons. The plasma is generated from a gas mixture containing oxygen, a second gas, and optional additives such as N.sub.2 O, He,or Ar. The second gas is selected from the group consisting of fluorocarbons, fluorosulfides, and chlorofluorocarbons. A currently preferred second gas is CFR.sub.4. The inventive method is also applicable for fabricating articles such as integrated circuits and semiconductor devices that comprise a parylene layer.

摘要翻译： 公开了一种从体内除去聚对二甲苯，其衍生物和共聚物（统称为“聚对二甲苯”）的方法，其包括能够产生相对高的去除速率的相对较大的体（例如印刷电路板）。 将诸如涂有聚对二甲苯的PC板的主体放置在微波等离子体下游的反应室中，使得由微波等离子体产生的等离子体放电产物与聚对二甲苯反应，蚀刻聚对二甲苯，而不会使身体暴露于能量离子和/ 或电子。 等离子体由含有氧气，第二气体和任选的添加剂如N2O，He或Ar的气体混合物产生。 第二气体选自碳氟化合物，氟代硫化物和氯氟化碳。 目前优选的第二气体是CFR4。 本发明的方法也适用于制造诸如集成电路和包含聚对二甲苯层的半导体器件的制品。