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公开(公告)号：US09261694B2
公开(公告)日：2016-02-16
申请号：US12985196
申请日：2011-01-05
CPC分类号： G02B26/02
摘要： Display devices incorporating light modulators are disclosed along with methods of manufacturing such devices. According to some aspects of the invention, a control matrix for controlling light modulators of a display includes a light absorbing layer that includes a material having a substantially light absorbing property.
摘要翻译： 公开了结合光调制器的显示装置以及制造这种装置的方法。 根据本发明的一些方面，用于控制显示器的光调制器的控制矩阵包括具有基本吸光性的材料的光吸收层。
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公开(公告)号：US20110122474A1
公开(公告)日：2011-05-26
申请号：US12985196
申请日：2011-01-05
CPC分类号： G02B26/02
摘要： Display devices incorporating light modulators are disclosed along with methods of manufacturing such devices. According to some aspects of the invention, a control matrix for controlling light modulators of a display includes a light absorbing layer that includes a material having a substantially light absorbing property.
摘要翻译： 公开了结合光调制器的显示装置以及制造这种装置的方法。 根据本发明的一些方面，用于控制显示器的光调制器的控制矩阵包括具有基本吸光性的材料的光吸收层。
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公开(公告)号：US20060166480A1
公开(公告)日：2006-07-27
申请号：US11043580
申请日：2005-01-26
申请人： Changhan Yun , Javier Villarreal
发明人： Changhan Yun , Javier Villarreal
IPC分类号： H01L21/4763
CPC分类号： B81C1/00301 , B81B2207/095 , B81C2203/0118 , H01L21/50 , H01L23/053 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Bridge structures provide a surface on which to form interconnections to components through through-hole vias. The bridge structures at least partially, and preferably fully, span the gap between two wafers, and, more specifically, between a through-hole via in one wafer and a corresponding component on the other wafer. Bridge structure may be formed on the wafer having the through-hole via and/or the wafer having the component.
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4.发明授权公开(公告)号：US06821561B2
公开(公告)日：2004-11-23
申请号：US10106385
申请日：2002-03-26
申请人： Javier Villarreal , Susan A. Alie
发明人： Javier Villarreal , Susan A. Alie
IPC分类号： C23C1404
CPC分类号： C23C14/042
摘要： A shadow mask material is selected so that the expansion characteristics of the shadow mask during thin film deposition closely match the expansion characteristics of the substrate. The shadow mask material is typically one with a low coefficient of thermal expansion (CTE). The shadow mask material must typically meet additional criteria, such as mechanical strength, feature quality, and dimensional accuracy criteria.
摘要翻译： 选择阴影掩模材料，使得薄膜沉积期间荫罩的膨胀特性与基板的膨胀特性紧密匹配。 荫罩材料通常是具有低热膨胀系数（CTE）的材料。 荫罩材料通常必须符合额外的标准，例如机械强度，特征质量和尺寸精度标准。
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公开(公告)号：US07608534B2
公开(公告)日：2009-10-27
申请号：US11043580
申请日：2005-01-26
IPC分类号： H10L21/20 , H10L21/4763
CPC分类号： B81C1/00301 , B81B2207/095 , B81C2203/0118 , H01L21/50 , H01L23/053 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： Bridge structures provide a surface on which to form interconnections to components through through-hole vias. The bridge structures at least partially, and preferably fully, span the gap between two wafers, and, more specifically, between a through-hole via in one wafer and a corresponding component on the other wafer. Bridge structure may be formed on the wafer having the through-hole via and/or the wafer having the component.
摘要翻译： 桥结构提供了一个表面，通过通孔通孔形成与组件的互连。 桥结构至少部分地，优选地完全跨越两个晶片之间的间隙，更具体地，在一个晶片中的通孔通孔和另一个晶片上的相应部件之间。 可以在具有通孔通孔和/或具有该部件的晶片的晶片上形成桥结构。
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