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公开(公告)号：US09475278B2
公开(公告)日：2016-10-25
申请号：US14394696
申请日：2012-06-18
CPC分类号： B41J2/1433 , B32B37/1284 , B32B37/18 , B32B38/0004 , B32B38/0008 , B41J2/01 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2/17503 , B41J2/1753 , Y10T156/1064
摘要： Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
摘要翻译： 控制基材和载体之间的粘合剂包括在印刷头的基材的背面的接合区域中形成凹陷，其中接合区域形成在靠近基板的厚度形成的供墨槽，从背面到前面 侧面 将粘合剂放置在接合区域和基板载体之间，并且将基板和基板载体移动到一起，使得粘合剂流入凹部。
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公开(公告)号：US20150145908A1
公开(公告)日：2015-05-28
申请号：US14394696
申请日：2012-06-18
CPC分类号： B41J2/1433 , B32B37/1284 , B32B37/18 , B32B38/0004 , B32B38/0008 , B41J2/01 , B41J2/14024 , B41J2/1603 , B41J2/1623 , B41J2/17503 , B41J2/1753 , Y10T156/1064
摘要： Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
摘要翻译： 控制基材和载体之间的粘合剂包括在印刷头的基材的背面的接合区域中形成凹陷，其中接合区域形成在靠近基板的厚度形成的供墨槽，从背面到前面 侧面 将粘合剂放置在接合区域和基板载体之间，并且将基板和基板载体移动到一起，使得粘合剂流入凹部。
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公开(公告)号：US08863388B2
公开(公告)日：2014-10-21
申请号：US13052401
申请日：2011-03-21
CPC分类号： B41J2/16 , B41J2/1623 , Y10T29/49401
摘要： A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.
摘要翻译： 粘合剂堆叠的方法包括将第一线粘合剂分配到第一基底上; 分配至少一个附加的粘合剂层的层叠在第一粘合剂线上; 以及将第二衬底放置在所述至少一个附加的粘合剂线上以连接所述第一和第二衬底。
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公开(公告)号：US20120242757A1
公开(公告)日：2012-09-27
申请号：US13052401
申请日：2011-03-21
CPC分类号： B41J2/16 , B41J2/1623 , Y10T29/49401
摘要： A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.
摘要翻译： 粘合剂堆叠的方法包括将第一线粘合剂分配到第一基底上; 分配至少一个附加的粘合剂层的层叠在第一粘合剂线上; 以及将第二衬底放置在所述至少一个附加的粘合剂线上以连接所述第一和第二衬底。
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