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公开(公告)号：US10994989B2
公开(公告)日：2021-05-04
申请号：US16476455
申请日：2017-12-15
申请人： Robert Bosch GmbH
发明人： Vijaye Rajaraman , Eckart Schellkes
摘要： A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.
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公开(公告)号：US20220395934A1
公开(公告)日：2022-12-15
申请号：US17602046
申请日：2019-10-30
申请人： Robert Bosch GmbH
发明人： Wallace Chuang , Eckart Schellkes , Yee-Wen Yen , Chia-Yu Liu
摘要： A solder paste includes a first solder alloy powder in an amount ranging from 30% to 95% by weight. The first solder alloy powder includes a first solder alloy with a solidus temperature of 200° C. to 260° C. The first solder alloy includes an Sn—Cu alloy or an Sn—Cu—Ag alloy. The solder paste further includes a second solder alloy powder in an amount ranging from 5% to 70% by weight, and a solder flux. The second solder alloy powder includes a second solder alloy with a solidus temperature below 250° C. The solder paste has a variable melting point. In multiple reflow soldering, a remelting of the solder paste is inhibited under different temperature conditions so that no functional failure occurs during assembly and/or packaging of PCBs or electronic devices due to melting of solder.
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公开(公告)号：US11287346B2
公开(公告)日：2022-03-29
申请号：US16633051
申请日：2018-07-16
申请人： Robert Bosch GmbH
发明人： Vijaye Rajaraman , Conrad Haeussermann , Florian Guffarth , Lars Sodan , Eckart Schellkes , Thomas Klaus
摘要： A pressure sensor system including at least one pressure sensor unit, the pressure sensor unit being configured with at least one sensor element which is situated in a cavity of a support structure, signal processing elements being integrated into support structure, the at least one sensor element being embeddable into the support structure to form the pressure sensor unit, and the support structure being formed by a land grid array/mold premold structure (LGA/MPM). The pressure sensor unit is introduced into a sensor housing to be provided with a diaphragm and is supported therein, a residual volume of the sensor housing, which is provided with at least one diaphragm and to the wiring of which the pressure sensor unit is electrically connected, being filled with an incompressible fluid. Also described is a method for manufacturing such a pressure sensor system and a measuring device.
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公开(公告)号：US10161769B2
公开(公告)日：2018-12-25
申请号：US15535505
申请日：2015-11-11
申请人： Robert Bosch GmbH
发明人： Wolfgang Woernle , Eckart Schellkes , Roland Seitz
摘要： A sensor device (10) for use in a motor vehicle includes a housing (11) for receiving a sensor element (1). The sensor element (1) has contact surfaces (21 to 23) electrically conductively connected with electrical plug connections (27) arranged in the housing (11), in the region of contacts (24 to 26), wherein the sensor element (1) is applied with force by a housing element (13), in the direction of the contacts (24 to 26) for the purposes of electrical contacting. A support in the form of a 3-point contact is formed between the sensor element (1) and the housing (11). The sensor element (1) has at least two measuring devices (5, 6), and the at least two measuring devices (5, 6) have three contact surfaces (21 to 23) that form the 3-point contact.
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公开(公告)号：US11221267B2
公开(公告)日：2022-01-11
申请号：US16336506
申请日：2017-09-06
申请人： Robert Bosch GmbH
发明人： Eckart Schellkes
摘要： A pressure sensor device of a pressure sensor, in particular a low- or medium-pressure sensor, for example a tire-pressure sensor, includes a sensing device that has a sensing side that can be turned toward a sensing environment having a fluid to be sensed; and, directly and/or indirectly on the sensing side, a fluid-pressure transmitting device, through which a fluid pressure of the fluid to be sensed is transmittable to the sensing device.
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公开(公告)号：US20210285836A1
公开(公告)日：2021-09-16
申请号：US16336506
申请日：2017-09-06
申请人： Robert Bosch GmbH
发明人： Eckart Schellkes
摘要： A pressure sensor device of a pressure sensor, in particular a low- or medium-pressure sensor, for example a tire-pressure sensor, includes a sensing device that has a sensing side that can be turned toward a sensing environment having a fluid to be sensed; and, directly and/or indirectly on the sensing side, a fluid-pressure transmitting device, through which a fluid pressure of the fluid to be sensed is transmittable to the sensing device.
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公开(公告)号：US20200055727A1
公开(公告)日：2020-02-20
申请号：US16476455
申请日：2017-12-15
申请人： Robert Bosch GmbH
发明人： Vijaye RAJARAMAN , Eckart Schellkes
摘要： A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.
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公开(公告)号：US20170343395A1
公开(公告)日：2017-11-30
申请号：US15535505
申请日：2015-11-11
申请人： Robert Bosch GmbH
发明人： Wolfgang Woernle , Eckart Schellkes , Roland Seitz
CPC分类号： G01D11/245 , G01D11/30 , G01L19/0084 , G01L19/142 , G01P1/02
摘要： The invention relates to a sensor device (10), in particular for use in a motor vehicle, comprising a housing (11) for receiving a sensor element (1), wherein the sensor element (1) has contact surfaces (21 to 23) that are electrically conductively connected with electrical plug connections (27) arranged in the housing (11), in the region of contacts (24 to 26), wherein the sensor element (1) is applied with force by a housing element (13), in particular formed as a housing cover, in the direction of the contacts (24 to 26) for the purposes of electrical contacting, and wherein a support in the form of a 3-point contact is formed between the sensor element (1) and the housing (11). According to the invention, the sensor element (1) has at least two measuring devices (5, 6), and the at least two measuring devices (5, 6) have three contact surfaces (21 to 23) that form the 3-point contact.
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公开(公告)号：US12030139B2
公开(公告)日：2024-07-09
申请号：US17602046
申请日：2019-10-30
申请人： Robert Bosch GmbH
发明人： Wallace Chuang , Eckart Schellkes , Yee-Wen Yen , Chia-Yu Liu
CPC分类号： B23K35/262 , B23K35/025 , C22C12/00 , C22C13/00
摘要： A solder paste includes a first solder alloy powder in an amount ranging from 30% to 95% by weight. The first solder alloy powder includes a first solder alloy with a solidus temperature of 200° C. to 260° C. The first solder alloy includes an Sn—Cu alloy or an Sn—Cu—Ag alloy. The solder paste further includes a second solder alloy powder in an amount ranging from 5% to 70% by weight, and a solder flux. The second solder alloy powder includes a second solder alloy with a solidus temperature below 250° C. The solder paste has a variable melting point. In multiple reflow soldering, a remelting of the solder paste is inhibited under different temperature conditions so that no functional failure occurs during assembly and/or packaging of PCBs or electronic devices due to melting of solder.
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公开(公告)号：US20170197824A1
公开(公告)日：2017-07-13
申请号：US15396867
申请日：2017-01-03
申请人： Robert Bosch GmbH
IPC分类号： B81C1/00
CPC分类号： B81C1/00333 , B81B7/0061 , B81B2201/0264 , B81B2207/012 , B81C1/00309 , B81C2203/0136 , B81C2203/0154 , B81C2203/0792 , G01L19/141
摘要： A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.
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