Composition for photoimaging
    1.
    发明授权
    Composition for photoimaging 失效
    光成像用组合物

    公开(公告)号:US5747223A

    公开(公告)日:1998-05-05

    申请号:US677230

    申请日:1996-07-09

    IPC分类号: G03C5/00 G03F7/038 H05K3/28

    CPC分类号: G03F7/038 H05K3/287

    摘要: An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60.degree. C. and about 110.degree. C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.

    摘要翻译: 提供了一种改进的可光成像的可阳离子聚合的环氧基涂料,适用于各种基材,包括用双氰胺固化的环氧玻璃层压板。 该材料包括基本上由约10重量%至约80重量%的多元醇树脂组成的环氧树脂体系,多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量%至72重量%的软化点为约60℃至约110℃,分子量为约600至2,500的溴化双酚A的环氧化缩水甘油醚。 任选地,可以向树脂体系中加入第三树脂。 向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂,其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于,对于2.0密耳厚的膜,在330至700nm区域中的光的吸光度小于0.1。 任选地,可加入光敏剂如苝及其衍生物或蒽及其衍生物。

    Composition for photoimaging
    2.
    发明授权
    Composition for photoimaging 失效
    光成像用组合物

    公开(公告)号:US06180317B2

    公开(公告)日:2001-01-30

    申请号:US07793889

    申请日:1991-11-18

    IPC分类号: G03C1725

    CPC分类号: G03F7/038

    摘要: An improved photoimagable cationically polymerizable epoxy based coating material is provided, that is suitable for use on a variety of substrates including epoxy-glass laminate boards cured with dicyandiamide. The material includes an epoxy resin system consisting essentially of between about 10% and about 80% by weight of a polyol resin which is a condensation product of epichlorohydrin and bisphenol A having a molecular weight of between about 40,000 and 130,000; and between about 35% and 72% by weight of an epoxidized glycidyl ether of a brominated bisphenol A having a softening point of between about 60° C. and about 110° C. and a molecular weight of between about 600 and 2,500. Optionally, a third resin may be added to the resin system. To this resin system is added about 0.1 to about 15 parts by weight per 100 parts of resin of a cationic photoinitiator capable of initiating polymerization of said epoxidized resin system upon exposure to actinic radiation; the system being further characterized by having an absorbance of light in the 330 to 700 nm region of less than 0.1 for a 2.0 mil thick film. Optionally a photosensitizer such as perylene and its derivatives or anthracene and its derivatives may be added.

    摘要翻译: 提供了一种改进的可光成像的可阳离子聚合的环氧基涂料,适用于各种基材,包括用双氰胺固化的环氧玻璃层压板。 该材料包括基本上由约10重量%至约80重量%的多元醇树脂组成的环氧树脂体系,多元醇树脂是分子量为约40,000至130,000的表氯醇和双酚A的缩合产物; 和约35重量%至72重量%的软化点在约60℃至约110℃之间且分子量为约600至2,500之间的溴化双酚A的环氧化缩水甘油醚。 任选地,可以向树脂体系中加入第三树脂。 向该树脂体系中添加约0.1〜约15重量份/ 100份阳离子光引发剂的树脂,其能够在暴露于光化辐射下引发所述环氧化树脂体系的聚合; 该系统的特征还在于,对于2.0密耳厚的膜,在330至700nm区域中的光的吸光度小于0.1。 任选地,可加入光敏剂如苝及其衍生物或蒽及其衍生物。