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1.发明授权公开(公告)号：US06610922B1
公开(公告)日：2003-08-26
申请号：US10027757
申请日：2001-12-20
IPC分类号： H05K900
CPC分类号： H05K9/0041
摘要： An apparatus for securing an electromagnetic shield in a conductive, casing includes a conductive frame, spring devices on a first edge of the frame that secure an electromagnetic shield in the frame and electrically couple the shield to the frame, and spring devices on a second edge of the frame that secure the frame in an aperture through a conductive casing and electrically couple the frame to the casing. An electromagnetic shielding apparatus includes a conductive frame, an electromagnetic shield of conductive material formed into cells, and spring devices on the frame that hold the shield in the frame and electrically couple the shield to the frame.
摘要翻译： 用于将电磁屏蔽件固定在导电壳体中的装置包括导电框架，在框架的第一边缘上的弹簧装置，其将电磁屏蔽件固定在框架中并将屏蔽件电耦合到框架，以及弹簧装置在第二边缘 该框架通过导电壳体将框架固定在孔中并将框架电耦合到壳体。 电磁屏蔽装置包括导电框架，形成电池的导电材料的电磁屏蔽以及框架上的弹性装置，其将屏蔽件固定在框架中并将屏蔽件电耦合到框架。
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公开(公告)号：US06414850B1
公开(公告)日：2002-07-02
申请号：US09481139
申请日：2000-01-11
IPC分类号： H05K114
CPC分类号： H05K1/0231 , H05K1/141 , H05K1/162 , H05K2201/10545 , H05K2201/10734
摘要： A small circuit board, preferably having or providing capacitance is mounted on the surface of a main circuit board opposite the surface where a BGA or other integrated circuit is mounted, and within the footprint defined the integrated circuit package. Preferably the small circuit board is formed from multiple interleaved conductive and dielectric layers to provide inherent capacitance in the circuit board itself. Capacitance provided by the small circuit board can be configured by selecting the number and/or size and/or placement of the conductive layers. Discrete devices can be mounted on the small circuit board if desired.
摘要翻译： 优选地具有或提供电容的小电路板安装在主电路板的与安装BGA或其他集成电路的表面相对的表面上，并且在该封装中限定了集成电路封装。 优选地，小电路板由多个交错的导电和电介质层形成，以在电路板本身中提供固有的电容。 可以通过选择导电层的数量和/或尺寸和/或放置来配置由小电路板提供的电容。 如果需要，分立器件可以安装在小电路板上。
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