Techniques for coupling an object to a circuit board using a surface mount coupling device
    1.
    发明授权
    Techniques for coupling an object to a circuit board using a surface mount coupling device 失效
    使用表面安装联接装置将物体耦合到电路板的技术

    公开(公告)号:US06924437B1

    公开(公告)日:2005-08-02

    申请号:US10411022

    申请日:2003-04-10

    摘要: A circuit board assembly includes a circuit board which defines circuit board pads, a set of surface mount electronic components soldered to a first set of the circuit board pads using a surface mount soldering process, and a set of surface mount coupling devices soldered to a second set of the circuit board pads using the surface mount soldering process. Each surface mount coupling device is configured to couple at least a portion of an object to the circuit board. Each surface mount coupling device includes a set of surface mount pads connected to the second set of the circuit board pads by solder joints resulting from the surface mount soldering process, a set of legs extending from the set of surface mount pads, and a body portion connected to the set of legs, the body portion providing a fixed structure relative to the circuit board for securing the object.

    摘要翻译: 电路板组件包括限定电路板焊盘的电路板,使用表面安装焊接工艺焊接到第一组电路板焊盘的一组表面安装电子部件,以及焊接到第二组件的一组表面安装耦合器件 使用表面贴装焊接工艺设置电路板焊盘。 每个表面安装联接装置被配置为将对象的至少一部分耦合到电路板。 每个表面安装耦合装置包括一组表面安装焊盘,其通过由表面安装焊接工艺产生的焊接接头连接到第二组电路板焊盘,一组从该组表面安装焊盘延伸出来的一条腿,以及主体部分 连接到该组腿,主体部分相对于电路板提供固定的结构,用于固定物体。

    Apparatus for securing an electromagnetic shield in a conductive casing
    2.
    发明授权
    Apparatus for securing an electromagnetic shield in a conductive casing 有权
    用于将电磁屏蔽固定在导电壳体中的装置

    公开(公告)号:US06610922B1

    公开(公告)日:2003-08-26

    申请号:US10027757

    申请日:2001-12-20

    IPC分类号: H05K900

    CPC分类号: H05K9/0041

    摘要: An apparatus for securing an electromagnetic shield in a conductive, casing includes a conductive frame, spring devices on a first edge of the frame that secure an electromagnetic shield in the frame and electrically couple the shield to the frame, and spring devices on a second edge of the frame that secure the frame in an aperture through a conductive casing and electrically couple the frame to the casing. An electromagnetic shielding apparatus includes a conductive frame, an electromagnetic shield of conductive material formed into cells, and spring devices on the frame that hold the shield in the frame and electrically couple the shield to the frame.

    摘要翻译: 用于将电磁屏蔽件固定在导电壳体中的装置包括导电框架,在框架的第一边缘上的弹簧装置,其将电磁屏蔽件固定在框架中并将屏蔽件电耦合到框架,以及弹簧装置在第二边缘 该框架通过导电壳体将框架固定在孔中并将框架电耦合到壳体。 电磁屏蔽装置包括导电框架,形成电池的导电材料的电磁屏蔽以及框架上的弹性装置,其将屏蔽件固定在框架中并将屏蔽件电耦合到框架。