Abstract:
The present invention provides a slurry composition for chemical mechanical polishing comprising spinel particles having the formula AO•xZ2O3 wherein A is at least one divalent cation, Z is at least one trivalent cation, and 0.01≦x≦100. The present invention also includes a method of chemical mechanical polishing the surface of a substrate using slurry compositions that include these spinel particles. The slurry compositions of the present invention provide the desired level of planarization and selectivity for both metal and oxide surfaces. In addition, the slurry compositions of the invention can be prepared such that they are substantially free of alpha phase alumina particles and other high hardness particles to produce a scratch-free polished surface.
Abstract translation:本发明提供一种用于化学机械抛光的浆料组合物,其包含具有式AO.xZ 2 O 3的尖晶石颗粒,其中A是至少一个二价阳离子,Z是至少一个三价阳离子,0.01 <= x <= 100。 本发明还包括使用包括这些尖晶石颗粒的浆料组合物化学机械抛光基材表面的方法。 本发明的浆料组合物为金属和氧化物表面提供所需的平坦化和选择性水平。 此外,可以制备本发明的浆料组合物,使得它们基本上不含α相氧化铝颗粒和其它高硬度颗粒以产生无刮擦的抛光表面。
Abstract:
Palladium or platinum catalyst values poisoned in course of catalyzing the reductive alkylation of an acid hydrazide are essentially completely reactivated by treating the spent catalyst values with a dilute aqueous solution of a lower monocarboxylic acid or a mineral acid and contacting the resultant slurry with oxygen gas or a labile oxygen containing compound.