公开(公告)号：US20100182765A1

公开(公告)日：2010-07-22

申请号：US12356812

申请日：2009-01-21

申请人： Robert L. Vadas ,  Timothy Arthur Eldon ,  Scott E. Post ,  Kurt Eric Gilbertson

发明人： Robert L. Vadas ,  Timothy Arthur Eldon ,  Scott E. Post ,  Kurt Eric Gilbertson

IPC分类号： H05K9/00

CPC分类号： H05K9/0026 ,  H01L23/552 ,  H01L2224/13 ,  H05K1/0218 ,  H05K9/0028 ,  H05K2201/10371 ,  H05K2201/10734

摘要： An RF/EMI shield has a planar conductive element and a plurality of solder spheres extending around the edges making electrical and mechanical contact with the conductive element to form a shield which can be soldered in a surface mount process directly over components needing shielding. The solder spheres have a diameter sufficient to provide the desired clearance between the shielding element and the component being shielded and a melting temperature equivalent to existing solder contacts to which the shield is bonded.

摘要翻译： RF / EMI屏蔽件具有平面导电元件和围绕边缘延伸的多个焊球，其与导电元件电接触和机械接触以形成屏蔽件，该屏蔽件可以直接在需要屏蔽的部件上以表面安装工艺焊接。 焊球具有足以在屏蔽元件和被屏蔽的部件之间提供期望的间隙的直径以及与屏蔽件所接合的现有焊料触点相当的熔化温度。